tag: Siemens EDA

Automating Traditional PCB Layout Verification With Electrically Based Design Rule Checks
By Rory Riggs - 28 May, 2026 - Comments: 0

Electrical verification and sign-off of a printed circuit board (PCB) is a challenging, tedious, and manual process. If time permits, this visual inspection to catch errors that might cause costly respins is done throughout the PCB layout process, but traditionally it is performed only once at the end of the design cycle. This approach creates significant project delays when issues are discover... » read more

Blog Review: May 27
By Jesse Allen - 27 May, 2026 - Comments: 0

Cadence's Igor Krause explains Precision Time Measurement (PTM), a PCIe feature that enables precise coordination of events across multiple components with independent local time clocks. Siemens' John McMillan suggests the way to achieve trusted traceability across the semiconductor supply chain is by implementing a blockchain-based distributed ledger paired with a secure digital twin. Sy... » read more

Blog Review: May 20
By Jesse Allen - 20 May, 2026 - Comments: 0

Cadence's Siddh Virani demonstrates how to import and integrate foreign language logic into PSS on both Target and Solve platforms, opening possibilities for code reuse and cross-language collaboration. Synopsys' Sumit Vishwakarma finds that AI model training and inference workloads are forcing the industry to rethink not only how much compute fits in a rack, but how servers are architected ... » read more

Chiplets Need A New Workflow
By Ann Mutschler - 14 May, 2026 - Comments: 0

Key Takeaways: Chiplet design turns semiconductor development into a system-level problem, requiring coordinated workflows across design, packaging, verification, test, and reliability. Successful chiplet workflows must handle multi-physics challenges — especially thermal, mechanical, power, and signal integrity — early enough to reduce costly failures before assembly and tape-out. ... » read more

Flash Getting Stacked High-Bandwidth Version
By Bryon Moyer - 14 May, 2026 - Comments: 1

Key takeaways: A new HBF 3D flash stack is similar to HBM for use in AI processing. HBF capacity will be much higher, allowing static storage of AI model weights, with optimized read speed. Samples are due out later this year, with accelerators featuring it coming out next year. AI inference using modern models requires billions of parameters, and moving them to where they c... » read more

Gates Add Functionality, But Wires Create Problems
By Brian Bailey - 14 May, 2026 - Comments: 0

Key takeaways: While transistors see continuous improvement, wires keep getting worse because of the smaller geometries and larger chip sizes. There are limited ways to avoid such problems, but the biggest impact will come from floorplanning. Analysis today is not adequate. New developments, such as backside power and 3D integration, provide temporary relief but new materials are a d... » read more

Harnessing Artificial Intelligence For Trusted IC Signoff
By Carey Robertson - 14 May, 2026 - Comments: 0

After years of behind-the-scenes work, artificial intelligence (AI) is now embedded throughout the technology world—from space exploration to everyday apps on our smartphones. There is a circular feedback loop in which we design more powerful computer chips to train AI models and use them; and then use those AI models to design even more powerful chips. The use of AI in the software used for ... » read more

ASIC Prototyping — New Design Realities Demand A New Approach
By Siemens EDA - 14 May, 2026 - Comments: 0

Modern ASIC design pushes prototypes to model vast RTL interactions across many FPGAs, often under high-bandwidth conditions that strain traditional systems. Verification teams also need fluid movement between emulation and at-speed prototyping, exposing any gaps in flow, tooling, or model continuity. This white paper presents an integrated solution that addresses these challenges through a uni... » read more

DFT In Automotive
By Ed Sperling - 13 May, 2026 - Comments: 0

Ensuring automotive chips are reliable, defect-free, and secure adds a whole new dimension to design for testability (DFT). Depending on the safety criticality of a system in an automobile, tests can range from key-on, once a car is started, to safety-critical features that may need to be tested every couple hundred milliseconds during operation. Lee Harrison, director of automotive IC solution... » read more

Smart Test Collides With The Data Chain
By Gregory Haley - 12 May, 2026 - Comments: 0

Key Takeaways: The promise of smart test is a data-chain problem before it is an algorithm problem. A device can pass every checkpoint and still carry a latent defect the test record never captured. As test grows more adaptive, the validity of the measurement environment matters as much as the measurement itself. For years, the test roadmap has pointed toward more adaptive f... » read more

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