tag: Siemens EDA

Blog Review: March 8
By Jesse Allen - 08 Mar, 2023 - Comments: 0

Synopsys' Rahul Thukral and Bhavana Chaurasia find that embedded MRAM is undergoing an uplift in utilization for low-power, advanced-node SoCs thanks to its high capacity, high density, and ability to scale to lower geometries. Siemens EDA's Chris Spear dives into the UVM Factory with a look at the  SystemVerilog Object-Oriented Programming concepts behind the factory. Cadence's Veena Pa... » read more

Test Challenges Mount As Demands For Reliability Increase
By Anne Meixner - 07 Mar, 2023 - Comments: 0

An emphasis of improving semiconductor quality is beginning to spread well beyond just data centers and automotive applications, where ICs play a role in mission- and safety-critical applications. But this focus on improved reliability is ratcheting up pressure throughout the test community, from lab to fab and into the field, in products where transistor density continues to grow — and wh... » read more

Automotive IoT Security By Design
By Lee Harrison - 02 Mar, 2023 - Comments: 0

A good example of the wider adoption and application of IoT devices is in automotive uses. It’s a growing market, with the worldwide number of IoT-connected devices projected to increase to 43 billion by 2023, an almost threefold increase from 2018. The modern vehicles that host so many IoT devices are increasingly connected—for cellular over-the-air updates, but also potentially to comm... » read more

Auto Cyberattacks Becoming More Widespread
By John Koon - 02 Mar, 2023 - Comments: 0

As vehicles become smarter, more complex, and increasingly connected, they also become more prone to cyberattacks. The challenge now is to keep pace with hackers, who are continually devising new and innovative ways to attack both software and hardware in vehicles. Recent statistics bear this out. In 2022, there was a big spike in deep/dark web activity and incidents related to application p... » read more

Designing for Data Flow
By Marie C. Baca - 02 Mar, 2023 - Comments: 0

Movement and management of data inside and outside of chips is becoming a central theme for a growing number of electronic systems, and a huge challenge for all of them. Entirely new architectures and techniques are being developed to reduce the movement of data and to accomplish more per compute cycle, and to speed the transfer of data between various components on a chip and between chips ... » read more

Design Challenges And Opportunities For Electric Powertrain With Vehicle Autonomy
By Siemens EDA - 01 Mar, 2023 - Comments: 0

According to recent studies, nearly 25% of all miles driven in the United States could be shared autonomous electrical vehicles (SAEVs) by 2030. Electric powertrain is indispensable for autonomous vehicles as it offers a) higher fuel efficiency and reduced CO2 emissions, b) an easier platform to support drive-by-wire systems needed for vehicle autonomy, and c) as battery prices keep dropping sh... » read more

Blog Review: March 1
By Jesse Allen - 01 Mar, 2023 - Comments: 0

Siemens EDA's Chris Spear explains the UVM Factory and how it can facilitate collaboration by enabling injection of new features without affecting your team. Cadence's Paul McLellan looks at efforts to ensure chiplets from different companies work together, particularly when the creating companies didn't pre-plan for those specific chiplets to work together, as well as the problems of failur... » read more

Taming Corner Explosion In Complex Chips
By Brian Bailey - 23 Feb, 2023 - Comments: 0

There is a tenuous balance between the number of corners a design team must consider, the cost of analysis, and the margins they insert to deal with them, but that tradeoff is becoming a lot more difficult. If too many corners of a chip are explored, it might never see production. If not enough corners are explored, it could reduce yield. And if too much margin is added, the device may not be c... » read more

Leveraging Chip Data To Improve Productivity
By Ann Mutschler - 23 Feb, 2023 - Comments: 1

The semiconductor ecosystem is scrambling to use data more effectively in order to increase the productivity of design teams, improve yield in the fab, and ultimately increase reliability of systems in the field. Data collection, analysis, and utilization is at the center of all these efforts and more. Data can be collected at every point in the design-through-manufacturing flow and into the f... » read more

Dealing With Performance Bottlenecks In SoCs
By Brian Bailey - 23 Feb, 2023 - Comments: 0

A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

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