Chiplet Security Risks Underestimated


The semiconductor ecosystem is abuzz with the promise of chiplets, but there is far less attention being paid to security in those chiplets or the heterogeneous systems into which they will be integrated. Disaggregating SoCs into chiplets significantly alters the cybersecurity threat landscape. Unlike a monolithic multi-function chip, which usually is manufactured using the same process tech... » read more

Growing Challenges For Increasingly Connected Vehicles


Automobiles will become increasingly connected over the next decade, but that connectivity will come at a price in terms of dollars, security, and constantly changing technology. Connectivity involves all parts of a vehicle. It includes everything from autonomous driving to in-cabin monitoring and connected infotainment. And it encompasses external sensors, IoT, V2X, over-the-air communicati... » read more

Chip Monitoring For Max Performance And Security


In a semiconductor market dominated by SoCs for high-performance computing, AI, automotive and 5G, semiconductor companies face myriad challenges and device requirements. The specific challenges for any given SoC vary but can include issues around performance debug and security against hacking. Top of the list includes the need to ensure quality, enhance safety, optimize performance, and increa... » read more

What’s Required To Secure Chips


Experts at the Table: Semiconductor Engineering sat down to talk about how to verify that a semiconductor design will be secure, with Mike Borza, Synopsys scientist; John Hallman, product manager for trust and security at Siemens EDA; Pete Hardee, group director for product management at Cadence; Paul Karazuba, vice president of marketing at Expedera; and Dave Kelf, CEO of Breker Verification. ... » read more

Navigating The Intersection Of Safety And Security


Automotive ICs can be secure without needing to be safe, but a safety critical IC cannot be safe without also being secure. Addressing the intersection of safety and security in highly complex automotive SoCs is challenging even for veteran project teams. This paper focuses on how these two domains intersect, what to consider when analyzing and implementing both safety and security architect... » read more

Blog Review: April 5


Synopsys's Gordon Cooper argues that AI transformer models, initially developed for natural language processing such as translation and question answering, are starting to make inroads in the computer vision application landscape and changing the direction of deep-learning architectures. Siemens' Patrick Hope shows how to identify opportunities to optimize a PCB design through the creation o... » read more

Adding Security Into Test


Security is becoming a much bigger concern as more electronics are added into cars, as more devices are connected to the internet, and as the value of data continues to increase. The problem is that security is dynamic. It continues to change throughout the lifetime of a system, and some of these devices are expected to last for a decade or more. Lee Harrison, director of Tessent product market... » read more

Mechanical Challenges Rise With Heterogeneous Integration


Companies integrating multiple chips or chiplets into a package will need to address structural and other mechanical engineering issues, but gaps in the design tools, new materials and interconnect technologies, and a shortage of expertise are making it difficult to address those issues. Throughout most of the history of the semiconductors, few people outside of foundries worried about struc... » read more

Do Necessary Tools Exist For RISC-V Verification?


Semiconductor Engineering sat down to discuss the verification of RISC-V processors with Pete Hardee, group director for product management at Cadence; Mike Eftimakis, vice president for strategy and ecosystem at Codasip; Simon Davidmann, founder and CEO of Imperas Software; Sven Beyer, program manager for processor verification at Siemens EDA; Kiran Vittal, senior director of alliances partner... » read more

Blog Review: March 29


Siemens' Heather George suggests adopting a shift-left strategy for complex designs that integrate multiple dies into a package and examines the challenges and opportunities for performing comprehensive tests on 2.5D and 3D IC designs. Synopsys' Shekhar Kapoor notes that when considering whether a system will perform as intended, techniques that work well for monolithic SoCs may not be as we... » read more

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