tag: Siemens

Blog Review: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2023 - Comments: 0

Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

AI Adoption Slow For Design Tools
By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Apr, 2023 - Comments: 0

Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

Designing For In-Circuit Monitors
By Ann Mutschler - 27 Apr, 2023 - Comments: 0

In every application space the semiconductor ecosystem touches, in-circuit monitors and sensors are playing an increasing role in silicon lifecycle management and concepts around reliability and resiliency — both during design as well as in the field. The combination of true system-level design, in/on-chip monitors, and improved data analysis are expected to drastically improve reliability... » read more

Week In Review: Design, Low Power
By Linda Christensen - 21 Apr, 2023 - Comments: 0

Cadence rolled out a slew of new products at this week’s CDNLive Silicon Valley, including: A new generative AI-powered tool for analog, mixed-signal, RF and photonics design; An extended collaboration with TSMC and Microsoft to advance giga-scale physical verification system in the cloud; A multi-year partnership with the San Francisco 49ers football organization, focused on sust... » read more

Blog Review: April 19
By Jesse Allen - 19 Apr, 2023 - Comments: 0

Synopsys' Soren Smidstrup and Kerim Genc explore how materials modeling helps battery designers explore the wide playing field for new battery materials and optimize performance by co-designing the structure and chemistry of new batteries, ultimately shortening development time and cost. Siemens' Stephen Chavez finds that enabling multiple engineers to work simultaneously within the same PCB... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 14 Apr, 2023 - Comments: 0

Public USB phone charging stations are now another vector that bad actors can use to plant malware and steal data on devices — known as "juice jacking," according to the United States’ Federal Communications Commission (FCC). The FCC is encouraging people to stay away from these public charging stations, found in airports and hotels, because of bad actors can install malware on the charging... » read more

Transitioning To Photonics
By Karen Heyman - 13 Apr, 2023 - Comments: 1

Silicon photonics is undergoing a resurgence as traditional approaches for reducing power and heat become more difficult and expensive, opening the door to a whole new set of technological challenges and driving up demand for a skill set that is in short supply today. From a technology standpoint, photonics is extremely complex. Signals drift, they are modulated with heat, and structures lik... » read more

Blog Review: April 12
By Jesse Allen - 12 Apr, 2023 - Comments: 0

Cadence's Ericles Sousa describes the five critical features of automotive SoC architectures that are essential for developing the next generation of passenger vehicles. In a podcast, Siemens' Steph Chavez chats with Gerry Partida of Summit Interconnect about the difficulties in collaboration between PCB designers and manufacturers, along with best practices that designers should follow to r... » read more

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