tag: Siemens

Uncovering Instabilities In Variational-Quantum Deep Q-Networks
By Fraunhofer IIS/EAS - 07 Jun, 2023 - Comments: 0

By Maja Franz (1), Lucas Wolf (1), Maniraman Periyasamy (2), Christian Ufrecht (2), Daniel D. Scherer (2), Axel Plinge (2), Christopher Mutschler (2), Wolfgang Mauerer (1,3) (1) Technical University of Applied Sciences, Regensburg, Germany, (2) Fraunhofer-IIS, Fraunhofer Institute for Integrated Circuits IIS, Division Positioning and Networks, Nuremberg, Germany, (3) Siemens AG, Corporate ... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 02 Jun, 2023 - Comments: 0

Japanese and American trade officials announced a joint roadmap for cooperation in strengthening global semiconductor supply chains by advancing Japan-U.S. collaboration with emerging and developing countries in the Indo-Pacific. China and South Korea agreed to strengthen dialogue and cooperation on semiconductor industry supply chains with a focus on the supply of key raw materials and ensu... » read more

Automotive Relationships Shifting With Chiplets
By Ann Mutschler - 24 May, 2023 - Comments: 0

The automotive industry is in the midst of a tremendous and rapid change on many fronts. OEMs are exploring new functions and features to add to their vehicles, including chiplets, electrification, autonomous features, as well as new vehicle architectures that will determine how vehicles are going to be designed from the foundation up. All of this is dependent on the relationships between all o... » read more

Week In Review: Semiconductor Manufacturing, Test
By Gregory Haley - 12 May, 2023 - Comments: 0

Global semiconductor sales reached $574 billion in 2022, and U.S. semiconductor companies accounted for sales totaling $275 billion, or 48% of the global market, according to the 2023 Factbook released by the Semiconductor Industry Association (SIA). DRAM and NAND prices likely will continue to fall further this quarter because production cuts have not kept pace with weakening demand, accord... » read more

Making Tradeoffs With AI/ML/DL
By Ann Mutschler - 11 May, 2023 - Comments: 0

Machine learning, deep learning, and AI increasingly are being used in chip design, and they are being used to design chips that are optimized for ML/DL/AI. The challenge is understanding the tradeoffs on both sides, both of which are becoming increasingly complex and intertwined. On the design side, machine learning has been viewed as just another tool in the design team's toolbox. That's s... » read more

Blog Review: May 10
By Jesse Allen - 10 May, 2023 - Comments: 0

Synopsys' Alessandra Nardi and Uyen Tran explain how to meet quality, reliability, functional safety, and security requirements of automotive chips through thorough test programs, path-margin monitoring, and design failure mode and effect analysis (DFMEA). Cadence's Veena Parthan explores how computational fluid dynamics can help predict and model the generation, propagation, and mitigation ... » read more

Blog Review: May 3
By Jesse Allen - 03 May, 2023 - Comments: 0

Synopsys' Thomas Andersen considers the requirements of AI-optimized chips that are resulting in exploration of different memory configurations, different types of memory, and different types of processor technologies and software components. Cadence's Girish Vaidyanathan considers the role of hierarchy and partitioning in custom design and looks at how a virtual hierarchy allows layout desi... » read more

AI Adoption Slow For Design Tools
By Brian Bailey - 01 May, 2023 - Comments: 0

A lot of excitement, and a fair amount of hype, surrounds what artificial intelligence (AI) can do for the EDA industry. But many challenges must be overcome before AI can start designing, verifying, and implementing chips for us. Should AI replace the algorithms in use today, or does it have a different role to play? At the end of the day, AI is a technique that has strengths and weaknesses... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Apr, 2023 - Comments: 0

Pervasive computing Renesas introduced a narrowband Internet of Things (NB-IoT) chipset and dev kit for the Indian market. The LTE NB-IoT modem chipset, the RH1NS200, was designed for Indian telecommunications carriers by targeting bands 1,3, 5 and 8 and by following India’s carrier-approved LTE protocol stack and software suite. Low power usage is built in — it has a low Power Saving Mode... » read more

Designing For In-Circuit Monitors
By Ann Mutschler - 27 Apr, 2023 - Comments: 0

In every application space the semiconductor ecosystem touches, in-circuit monitors and sensors are playing an increasing role in silicon lifecycle management and concepts around reliability and resiliency — both during design as well as in the field. The combination of true system-level design, in/on-chip monitors, and improved data analysis are expected to drastically improve reliability... » read more

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