Blog Review: Dec. 3


Cadence's Reela Samuel notes that as multi-die integration becomes the new engine of semiconductor performance, the decision between 2.5D and 3D-IC architectures shapes a design's achievable bandwidth, energy efficiency, thermal limits, system size, and even program schedules. Synopsys' Thomas Andersen suggests that the deployment of physical AI will require the fusion of advanced electronic... » read more

FPGAs Find New Workloads In The High-Speed AI Era


FPGAs are finding new applications in the age of artificial intelligence, high-speed wireless communications, medical and life science technology, and in complex chip architectures where they can improve the flow of data. Field-programmable gate arrays (FPGAs) enable designers to reprogram or reconfigure digital logic after the chips have been deployed, which is essential in the AI world, wher... » read more

Chip Industry Week In Review


China's Hefei Lumiverse Technology reportedly has developed a desktop-sized High Harmonic Generation light source that generates wavelengths as small as 1nm. One customer already has used it to produce 14nm chips, which was the original target node for EUV, according to one report. As a point of comparison, TSMC and Samsung didn't start using EUV until the 7nm node, relying instead on immersion... » read more

The Future For Formal Verification


Experts at the table: Semiconductor Engineering sat down to discuss possible future directions for formal verification technology with Ashish Darbari, CEO for Axiomise; Jin Zhang, product management group director for the Verification Group at Cadence; Sean Safarpour, executive director for R&D at Synopsys; and Jeremy Levitt, principal engineer for Digital Verification Technology at Siemen... » read more

Chip Industry Week in Review


SK hynix is ramping HBM manufacturing capacity to meet explosive demand for AI data centers. The company will launch 16-stack HBM4 next year, and up to 12-stack HBM4E. HBM5 and HBM5E will be introduced between 2029 and 2031, reports Business Korea. China will not have access to NVIDIA’s most advanced chips, President Trump told 60 Minutes. The Dutch economy minister said Nexperia's chip... » read more

LLMs Add Safety Risks To Physical AI


Humanoid robots with artificial general intelligence are some years from entering our daily life, but application-specific robotics are already here. From Amazon’s fleet of fulfillment center robots to robotic surgical systems in operating rooms, search and rescue robo-dogs, autonomous drones, and last-mile delivery robots, all the way down to the humble Roomba vacuum cleaner, physical AI sys... » read more

Chip Industry Week in Review


San Francisco-based Substrate raised more than $100 million to build a vertically integrated foundry that uses particle accelerators to produce "the world's brightest beams, enabling a new method of advanced X-ray lithography." The company claims its technology is comparable to ASML's high NA EUV, and notes it can extend well beyond 2nm. ASML has not publicly commented. The Nexperia chip sho... » read more

Advances In Formal Verification Technology


Experts at the table: Semiconductor Engineering sat down to discuss advances in formal verification tools and methodologies with Ashish Darbari, CEO for Axiomise; Jin Zhang, product management group director for the Verification Group at Cadence; Sean Safarpour, executive director for R&D at Synopsys; and Jeremy Levitt, principal engineer for Digital Verification Technology at Siemens EDA.... » read more

Chip Industry Week in Review


Retaliations and countermoves leading up to planned trade talks between the U.S. and China led experts to wonder, 'Who's winning?' New activity on this front: China issued questionnaires to some U.S. semiconductor firms as part of an anti-dumping probe, demanding detailed data on sales, profit margins, logistics costs and Chinese customer names for analog chips. The probe appears aimed at ... » read more

Startup Tips To Get From Seed Funding To Series A, B, C


Startups are often created by experienced engineers who figure out how to solve a technical problem they are dealing with at work, or by PhD candidates in research labs before they have even started their first full-time job. Either way, getting seed money to the tune of a few million dollars is relatively easy compared to securing further rounds of funding and achieving the company’s exit go... » read more

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