tag: Siliconware

Scaling Bump Pitches In Advanced Packaging
By Mark LaPedus - 25 Oct, 2021 - Comments: 0

Interconnects for advanced packaging are at a crossroads as an assortment of new package types are pushing further into the mainstream, with some vendors opting to extend the traditional bump approaches while others roll out new ones to replace them. The goal in all cases is to ensure signal integrity between components in IC packages as the volume of data being processed increases. But as d... » read more

Bumps Vs. Hybrid Bonding For Advanced Packaging
By Mark LaPedus - 23 Jun, 2021 - Comments: 3

Advanced packaging continues to gain steam, but now customers must decide whether to design their next high-end packages using existing interconnect schemes or move to a next-generation, higher-density technology called copper hybrid bonding. The decision is far from simple, and in some cases both technologies may be used. Each technology adds new capabilities in next-generation advanced pac... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Mar, 2020 - Comments: 0

Chipmakers TrendForce has released its projected foundry rankings in terms of sales for the first quarter. TSMC is still in first place, followed by Samsung, GlobalFoundries and UMC. Samsung has been ramping up chips based on its 7nm logic process using extreme ultraviolet (EUV) lithography. Now, Samsung is ramping up its DRAM devices using EUV and plans to expand its capacity in the arena.... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 26 Jan, 2018 - Comments: 0

Chipmakers The IC industry continues to consolidate. For example, Qualcomm has a proposed plan to buy NXP. And then, Broadcom wants to buy Qualcomm. Who is next? In a research note, RBC Capital Markets analyst Mitch Steves said: “According to Bloomberg, Microsemi is exploring a sale and we think logical acquirers could include Skyworks. We continue to view Microsemi as a notable strategic as... » read more

ASE-SPIL Merger Wins Clearance
By Mark LaPedus - 24 Nov, 2017 - Comments: 0

Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL) have finally received all anti-trust approvals for the proposed and long-awaited merger between the two IC packaging houses. The anti-trust approvals are a big step that clears the way for the creation of a combined ASE-SPIL entity. The ASE-SPIL entity, in turn, will create a powerhouse in the outsourced ... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Jul, 2017 - Comments: 0

Chipmakers UMC has generated sales from its recently-announced 14nm finFET technology. The foundry vendor also plans to enter the 22nm process technology market. UMC will join other players in the 22nm arena, such as GlobalFoundries, Intel and TSMC. “So we do have a plan to introduce our 22nm as well and it will be available around 2018,” said Jason Wang, the newly appointed co-president o... » read more

China’s Capital Equipment Market To Boom
By Jeff Dorsch - 18 Aug, 2016 - Comments: 1

The worldwide semiconductor capital equipment market declined 3% last year to $36.53 billion from 2014’s $37.5 billion, but inside China the story was significantly different. Capital equipment sales there increased by 12% in 2015, to $4.9 billion. In fact, only Japan showed a higher growth rate last year, of 31%, according to figures from [getentity id="22821" comment="SEMI"] and the Semi... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 06 May, 2016 - Comments: 0

Chipmakers Samsung has rolled out the Samsung Family Hub Refrigerator, an appliance that changes the landscape in the refrigerator market. The refrigerator comes with a 21.5-inch LCD touchscreen, which serves as the digital command center and connects to a smartphone. It enables consumers to view inside the fridge with a smartphone while grocery shopping. It can access music or television cont... » read more

Inside The OSAT Business
By Mark LaPedus - 17 Mar, 2016 - Comments: 0

Semiconductor Engineering sat down to discuss the IC-packaging industry, foundries, China and other topics with Tien Wu, chief operating officer at Taiwan's Advanced Semiconductor Engineering (ASE), the world's largest outsourced semiconductor assembly and test (OSAT) vendor. What follows are excerpts of that conversation. SE: What is your overall outlook for 2016? Wu: Last year, the semi... » read more

Consolidation Hits OSAT Biz
By Mark LaPedus - 18 Feb, 2016 - Comments: 0

The outsourced semiconductor assembly and test (OSAT) industry is undergoing a new wave of acquisition activity that will dramatically reshape the packaging and test services markets. [getkc id="83" kc_name="OSATs"] have seen a considerable amount of consolidation over the years, but the industry needs a scorecard to keep track of the recent deals and the resulting fallout. One OSAT deal inv... » read more

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