tag: SK Hynix

How To Make 3D NAND
By Mark LaPedus - 23 May, 2016 - Comments: 0

In 2013, Samsung reached a major milestone in the IC industry by shipping the world’s first 3D NAND device. Now, after some delays and uncertainty, Intel, Micron, SK Hynix and the SanDisk/Toshiba duo are finally ramping up or sampling 3D NAND. 3D NAND is the long-awaited successor to today’s planar or 2D NAND, which is used in memory cards, solid-state storage drives (SSDs), USB flash dr... » read more

What’s Next For NAND?
By Mark LaPedus - 19 May, 2016 - Comments: 2

NAND flash memory is a key enabler in today’s systems, but it’s a difficult business. NAND suppliers require deep pockets and strong technology to survive in the competitive landscape. And going forward, vendors face new challenges on several fronts. On one front, for example, the overall NAND market is currently in the doldrums, amid soft product prices and a mild capacity glut. Demand ... » read more

What Happened To DSA?
By Mark LaPedus - 19 May, 2016 - Comments: 2

Directed self-assembly (DSA) was until recently a rising star in the next-generation lithography (NGL) landscape, but the technology has recently lost some of its luster, if not its momentum. So what happened? Nearly five years ago, an obscure patterning technology called [gettech id="31046" t_name="DSA"] burst onto the scene and began to generate momentum in the industry. At about that t... » read more

High-Bandwidth Memory
By eSilicon - 27 Apr, 2016 - Comments: 0

High-bandwidth memory (HBM) is a JEDEC-defined standard, dynamic random access memory (DRAM) technology that uses through-silicon vias (TSVs) to interconnect stacked DRAM die. In its first implementation, it is being integrated with a system-on-chip (SoC) logic die using 2.5D silicon interposer technology. This white paper explains HBM’s value proposition, and how these five companies make... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Apr, 2016 - Comments: 0

Chipmakers As reported, Samsung is expanding its efforts in the foundry business, a move that will put the company on a collision course with TSMC and others. Samsung's foundry unit is expanding is logic portfolio and moving into the specialty foundry front. It will also make its advanced packaging technology available, such as 2.5D interposers, to customers. In a blog, Samsung said it plans t... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 15 Apr, 2016 - Comments: 0

Chipmakers TSMC remained the world’s largest foundry vendor with a 54.3% share in 2015, according to the rankings from Gartner. GlobalFoundries moved into the No. 2 position with 9.6% of the market. The No. 3 position went to UMC with $4.5 billion in revenue, representing 9.3% of the market, according to the firm, which said Samsung remains No. 4. SMIC, which is No. 5, is gaining ground. ... » read more

It’s All About DRAM
By Ed Sperling - 14 Apr, 2016 - Comments: 4

For decades, the starting point for compute architectures was the processor. In the future, it likely will be the DRAM architecture. Dynamic random access memory always has played a big role in computing. Since IBM's Robert Dennard invented DRAM back in 1966, it has become the gold standard for off-chip memory. It's fast, cheap, reliable, and at least until about 20nm, it has scaled quite n... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Apr, 2016 - Comments: 0

Fab tool vendors In terms of sales for 2015, Applied Materials retained the No. 1 position in the wafer fab equipment (WFE) market with 1.3% growth last year, according to Garnter. Lam Research experienced the strongest growth of the top 10 vendors in 2015, moving into the No. 2 position. In the rankings, Lam jumped ahead of ASML and TEL. ASML was in third place, followed in order by TEL, KLA-... » read more

How Many Cores? (Part 2)
By Ed Sperling - 21 Mar, 2016 - Comments: 1

New chip architectures and new packaging options—including fan-outs and 2.5D—are changing basic design considerations for how many cores are needed, what they are used for, and how to solve some increasingly troublesome bottlenecks. As reported in part one, just adding more cores doesn't necessarily improve performance, and adding the wrong size or kinds of cores wastes power. That has s... » read more

Timing Is Everything
By Ed Sperling - 17 Mar, 2016 - Comments: 0

It's easy to look back on companies or products that missed the market because they were too early. Remember the Eo? The brick-like personal digital assistant that AT&T introduced in 1993 had an antenna that hinted at 4G connectivity. Unfortunately, there was no 4G available at the time, so it was just an extra wire. (Check out the video of the tablet version here.) The EO 440 Personal... » read more

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