Manufacturing Bits: Jan. 10

By Mark LaPedus - 10 Jan, 2022 - Comments: 2

Finding new materials with inverse design The Singapore-MIT Alliance for Research and Technology (SMART) has found a new way to perform general inverse design, a technique that can accelerate the discovery of new materials. The concept of inverse design is simple. Let’s say you want to develop products with select materials. In a computer, you input the desired materials and the propertie... » read more

Efficient Low-Cost Implementation of NB-IoT for Smart Applications

By Synopsys - 27 Feb, 2019 - Comments: 0

NB-IoT is an emerging technology for narrowband wireless communication standardized by 3GPP. It has been designed with a focus on minimizing end-user equipment processing requirements and power consumption to enable the massive deployment of low-cost devices for a broad range of smart applications. This white paper highlights the key challenges of NB-IoT modem design. It proposes a hardware/sof... » read more

System Bits: Aug. 1

By Linda Christensen - 01 Aug, 2017 - Comments: 0

Quantum Computing Takes A Step Forward UCLA physicists have developed a technique for measuring and controlling the energy differences of electron valley states in silicon quantum dots, which they view as a key component of quantum computing. Joshua Schoenfield, a UCLA graduate student and one of the paper's authors, explained that "an individual qubit can exist in a complex wave-like m... » read more

Manufacturing Bits: June 30

By Mark LaPedus - 30 Jun, 2015 - Comments: 0

3D printed supercars Divergent Microfactories has rolled out a new approach to auto manufacturing based on 3D printing. The technology is based on what the company calls a Node. A Node is a metal alloy that is produced using 3D printers. The Nodes are combined with carbon fiber tubes, which, in turn, enable the development of a car chassis. [caption id="attachment_20782" align="alignleft... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: smart

Manufacturing Bits: Jan. 10

Efficient Low-Cost Implementation of NB-IoT for Smart Applications

System Bits: Aug. 1

Manufacturing Bits: June 30