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Week in Review: Manufacturing, Test


Industry Numbers NAND flash memory is forecast to hit US $83 billion this year, an increase of 24%. DRAM is projected to hit $118 billion, up 25%, according to a recent Yole report. Both are historic records. DRAM and NAND revenues are expected to be a $260 billion market in 2027 (combined), with advanced technologies such as EUV lithography, hybrid bonding and 3D DRAM driving this. SEMI in... » read more

Week In Review: Manufacturing, Test


It's earnings season, and despite widespread reports of capacity issues and shortages, the chip industry turned in relatively solid results across the board. Intel exceeded January guidance for Q1, reporting first-quarter GAAP revenue of $18.4 billion, a 7% year-over-year decrease, and a 1% decrease year-over-year on non-GAAP basis. Record revenue was achieved in the Network and Edge Group, ... » read more

Week In Review: Manufacturing, Test


The U.S. Senate approved the 2022 America COMPETES act, which has big ramifications for the chip industry. The bill now heads to the House for further reconciliation. If approved, it would provide more than $50 billion in U.S. subsidies for semiconductor chip manufacturing. The SIAC (Semiconductor In America Coalition) urged Congress to act promptly to achieve a bipartisan compromise soon and o... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel has announced a definitive agreement to acquire Tower, a specialty foundry vendor, for approximately $5.4 billion. With the acquisition of Tower, Intel expands its efforts in the foundry business, and put its rivals on notice. With Tower, Intel gains access to mature processes as well as specialty technologies, such as analog, CMOS image sensor, MEMS, power management and RF. ... » read more

Week In Review: Manufacturing, Test


Fab tools Lam Research has rolled out a new suite of selective etch products for use in developing next-generation technologies, such as gate-all-around (GAA) transistors. In the fab, selective etch helps chipmakers with complex structures. These etch tools provide selective and precision etching without modifying or causing damage to other critical material layers. Composed of three new... » read more

Week In Review: Manufacturing, Test


Government policy The Government of Quebec and IBM have announced a new partnership to establish Quebec as a technology hub in the development of quantum computing, artificial intelligence, semiconductors and high-performance computing. The two entities have formed the Quebec-IBM Discovery Accelerator. The new technology hub aims to focus on developing new projects, collaborations, and skills-... » read more

Startup Funding: January 2022


China's startups are the star of the month once again, with more companies based or co-headquartered in the country receiving funding in January 2022 than the rest of the world combined. Exact investment figures for Chinese startups are frequently not reported, but based on minimum amounts given, they raised more than the rest of the world as well. The largest round of the month went to a co... » read more

200mm Shortages May Persist For Years


A surge in demand for chips at more mature process nodes is causing shortages for both 200mm foundry capacity and 200mm equipment, and it shows no signs of letting up. In fact, even with new capacity coming on line this year, shortages are likely to persist for years, driving up prices and forcing significant changes across the semiconductor supply chain. Shortages for both 200mm foundry cap... » read more

China Accelerates Foundry, Power Semi Efforts


China has unveiled several initiatives to advance its domestic semiconductor industry, including a new and massive fab expansion campaign in the foundry, gallium-nitride (GaN), and silicon carbide (SiC) markets. The nation is making a big push into what it calls “third-generation semiconductors,” which is a misnomer. The term actually refers to two existing and common power semiconductor... » read more

Week In Review: Manufacturing, Test


Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

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