Week In Review: Design, Low Power

By Jesse Allen - 07 Jun, 2019 - Comments: 0

M&A Infineon Technologies will acquire Cypress Semiconductor for $23.85 per share in cash, or $10.1 billion. The deal will place Infineon as the number eight chip manufacturer in the world based on 2018 revenues and create an automotive powerhouse, making the combined company the largest supplier of chips to the automotive market. Infineon sees potential to reach into new industrial and co... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 20 Jul, 2018 - Comments: 0

Cybersecurity Rambus signed a patent license agreement with Socionext, a designer of system-on-a-chip devices. Socionext will use Rambus technology in memory controllers, serializers/deserializers, and security applications. Netskope acquired Sift Security, adding 10 technical employees to its headcount of more than 500 people; financial terms weren’t revealed. Sift CEO Neil King was tapp... » read more

Week In Review: Design, Low Power

By Jesse Allen - 20 Jul, 2018 - Comments: 0

Aldec expanded the rule-checking capabilities of its ALINT-PRO tool, adding twice as many FSM checks and new graphical representations to aid state exploration. Also included is enhanced setup automation for complex Xilinx Vivado and ISE projects that automatically organizes a workspace to deliver hierarchical and incremental DRC and CDC analysis. Xilinx acquired AI startup DeePhi Technology... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 29 Jun, 2018 - Comments: 0

Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

The Week In Review: Design

By Jesse Allen - 17 Nov, 2017 - Comments: 0

Tools Aldec released the latest version of its Riviera-PRO verification platform, adding QEMU Bridge to enable hardware/software co-simulation of designs intended to run on SoC FPGAs. Other features include improved performance when using code containing many inline randomized calls and up to 29% faster simulation speed of UVM. Pulsic added new features to its Unity Bus Planner for planning... » read more

The Week In Review: Design

By Jesse Allen - 03 Nov, 2017 - Comments: 0

M&A Synopsys will acquire Black Duck Software, a provider of software for securing and managing open source software. Synopsys already has a stake in this area from its Coverity acquisition in 2014, which it has been using to analyze security practices in open source software. Founded in 2003 and headquartered in Massachusetts, Black Duck's products automate the process of identifying and ... » read more

Blog Review: Aug. 19

By Jesse Allen - 19 Aug, 2015 - Comments: 1

Several of this week's top reads from Ansys' Justin Nescott sound like they're straight from the pages of sci-fi novels (and comic books). An MIT project is getting close to creating the Iron Man suit, one company plans to finally build a space elevator, and Los Angeles takes an innovative approach to fighting the California drought: 96 million black plastic balls. Smartphones are so yestery... » read more

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Knowledge Centers
Entities, people and technologies explored

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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

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The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

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Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Socionext

Week In Review: Design, Low Power

Week in Review: IoT, Security, Auto

Week In Review: Design, Low Power

Week In Review: Manufacturing, Test

The Week In Review: Design

The Week In Review: Design

Blog Review: Aug. 19

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