tag: Soitec

FD-SOI Adoption Expands
By Ed Sperling - 21 Feb, 2018 - Comments: 2

Fully depleted silicon-on-insulator (FD-SOI) is gaining ground across a number of new markets, ranging from IoT to automotive to machine learning, and diverging sharply from its original position as a less costly alternative to finFET-based designs. For years, [getkc id="220" kc_name="FD-SOI"] has been viewed as an either/or solution targeted at the same markets as bulk [gettech id="31093" c... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 01 Dec, 2017 - Comments: 0

Chipmakers The 2017 top-ten rankings of foundries remain the same as last year, according to TrendForce. TSMC, GlobalFoundries and United Microelectronics Corp. (UMC) rank first, second, and third, respectively, in terms of projected sales in 2017, according to TrendForce. TSMC has a dominant market share of 55.9%. In the rankings, Samsung is in fourth place, followed in order by SMIC, TowerJa... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 22 Sep, 2017 - Comments: 0

Chipmakers GlobalFoundries has asked European antitrust regulators to investigate TSMC over alleged unfair competition, according to a report from Reuters. Commenting on the report, a spokeswoman for GlobalFoundries said: “We are not surprised that the European Commission is looking into anti-competitive market practices and abusive conduct in the semiconductor sector. The semiconductor indu... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 30 Jun, 2017 - Comments: 0

Chipmakers Toshiba and its fab partner, Western Digital, have jointly rolled out a 96-layer 3D NAND product amid a legal dispute. The companies have developed prototype samples of a 96-layer 3D NAND device. Samples of the new 96-layer product, which is a 256 gigabit (32 gigabytes) device, is scheduled for release in the second half of 2017 and mass production is targeted for 2018. Separately, ... » read more

22nm Process War Begins
By Mark LaPedus - 23 Apr, 2017 - Comments: 1

Many foundry customers at the 28nm node and above are developing new chips and are exploring the idea of migrating to 16nm/14nm and beyond. But for the most part, those companies are stuck because they can’t afford the soaring IC design costs at advanced nodes. Seeking to satisfy a potential gap in the market, [getentity id="22819" comment="GlobalFoundries"], [getentity id="22846" e_name="... » read more

Will There Be Enough Silicon Wafers?
By Mark LaPedus - 20 Oct, 2016 - Comments: 3

The silicon wafer industry, a critical part of the IC supply chain, is undergoing a new and perhaps alarming wave of merger and acquisition activity. While consolidation in this sector is not new, the pace of M&A activity is picking up and there are fewer companies left. Silicon wafer makers produce and sell raw silicon wafers to chipmakers, which process them into chips. But despite con... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

Internet of FD-SOI Things?
By Katherine Derbyshire - 18 Feb, 2016 - Comments: 0

Are fully-depleted silicon-on-insulator (FD-SOI) wafers having a moment? Certainly SOI wafers are not new. Soitec’s SmartCut layer transfer technology was patented in 1994, and wafers with implanted oxide layers were available before that. Still, adoption of SOI wafers has been limited. Though they offer improved device isolation and reduced parasitics, the increased wafer cost has been an ob... » read more

Manufacturing Bits: Dec. 8
By Mark LaPedus - 08 Dec, 2015 - Comments: 0

Quantum computing At this week’s IEEE International Electron Devices Meeting (IEDM) in Washington, D.C., chipmakers, research institutes and universities presented a plethora of papers on several subjects. A large number of papers revolve around the same theme—How to extend Moore’s Law. For this, researchers are working on a number of short- and long-term technologies to propel device... » read more

Challenges At Advanced Nodes
By Ed Sperling - 09 Sep, 2015 - Comments: 0

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

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