Week In Review: Manufacturing & Design

By Mark LaPedus - 25 Oct, 2013 - Comments: 0

Don’t look now, but Intel is expanding its foundry business. Previously, Intel garnered a small collection of foundry customers. But Intel would not entertain foundry customers that had competitive products based on ARM chips. Apparently, Intel is having a change of heart. “I think they’ve changed their position,” said Nathan Brookwood, a research fellow at Insight 64. “They will do A... » read more

Inside Leti’s Litho Lab

By Mark LaPedus - 16 May, 2013 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss future lithography challenges with Serge Tedesco, lithography program manager at CEA-Leti; Laurent Pain, lithography lab manager at CEA-Leti; and Raluca Tiron, a senior scientist at CEA-Leti. SMD: CEA-Leti has two major and separate programs, including one in directed self-assembly (DSA) and another in multi-beam ... » read more

DSA Moves To R&D Pilot Lines

By Ed Sperling - 31 Jul, 2012 - Comments: 0

By Mark LaPedus Directed self-assembly (DSA), an alternative lithography technology that makes use of block copolymers, is still in the R&D stage for semiconductor production. But as the exotic patterning technology continues to make astounding progress, there are signs the IC industry is accelerating its efforts to bring DSA from the lab to the fab. In fact, DSA suddenly has become a ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week In Review: Manufacturing & Design

Inside Leti’s Litho Lab

DSA Moves To R&D Pilot Lines

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