tag: Sonics

Wide I/O’s Impact On Memory
By Ed Sperling - 25 Aug, 2011 - Comments: 0

By Ann Steffora Mutschler Driven by the need to reduce power but increase bandwidth in smart phones and other mobile devices, system architects are grappling with new technologies to take system performance to the next level. Wide I/O, as well as some DDR technologies, are vying for center stage in tomorrow’s leading-edge mobile designs. “The big technological advancement that allows a ... » read more

Summertime…And The Living (Isn’t) Easy
By Various Writers - 25 Aug, 2011 - Comments: 0

By Jack Browne Normally summer is a time where most people slow down, relax, take vacations and the pace slows down accordingly with the seasonal ebb and flow of our industry. But not this summer. Exhibit A, B, C, D and so on: This past month has demonstrated the profound element of change. Mostly in our wallets. The stock market volatility and global economic disruptions have echoed (an... » read more

Solving Memory Subsystem Bottlenecks In 3D Stacks
By Ann Mutschler - 28 Jul, 2011 - Comments: 0

In today’s do-or-die market environment, many SOC makers strive to differentiate their product based upon the rate at which it performs processing. Closely coupled are power concerns that have led to dominance of a multi-core approach, while economic considerations have resulted in the dominance of the Unified Memory Architecture, where all the processors share access to external DRAM. Stacki... » read more

High Stakes Domination
By Frank Ferro - 28 Jul, 2011 - Comments: 0

By Frank Ferro As an I IP provider, I have been watching with great interest the patent battles taking place between the major players in the wireless market. The now seemingly daily announcements of new lawsuits in the mobile consumer market translate to several things—wireless devices have become true consumer items, the dollars are high and new companies have reshaped the market landscape... » read more

SoC Design In 5 Years
By Ed Sperling - 30 Jun, 2011 - Comments: 0

By Ed Sperling The semiconductor industry is used to looking at changes every couple of years, based upon the progression of Moore’s Law. But look out further, over the next five years when the most advanced process node is somewhere between 14nm and 16nm, and the job of designing and manufacturing an SoC will look very different. At the center of this change are three very significant tr... » read more

Playing Hardball With Software
By Frank Ferro - 30 Jun, 2011 - Comments: 0

By Frank Ferro Software is never-ending, or so the axiom goes. It shouldn’t take long to convince anyone that has used an electronic device of the truth of this statement. The PC environment is the most obvious (and obnoxious) example with daily application software updates, at the most inconvenient times, coupled with regularly scheduled updates for the OS. Even embedded devices like media ... » read more

Tech Talk: Sonics CTO
By Ed Sperling - 07 Jun, 2011 - Comments: 0

Drew Wingard peels back the covers on dark silicon, the next big thing in semiconductors and what's needed to get there in a candid discussion with System-Level Design. [youtube vid=ciWTa2HGCkE] » read more

The Upside Of Dark Silicon
By Ed Sperling - 26 May, 2011 - Comments: 0

By Ed Sperling For many years the real challenge in IC design was in shrinking the components and features on a piece of silicon without burning up the chip or destroying signal integrity. Chipmakers have become quite adept at this over the past few decades. Too good, in fact. Now they are faced with a different kind of problem—what to do with all that extra silicon. Just as the long dist... » read more

Powering Forward Or Moon Walking?
By Frank Ferro - 26 May, 2011 - Comments: 0

By Frank Ferro How many of us would go back to watching television in black and white, or carry around a 10-pound laptop or cell phone that resembles the ones in original brick form? For most consumers, it would even be hard to turn back the clock on more recent innovations like Wi-Fi and digital cameras (finding a place to plug-in the lap, run wires through the house, carrying around film! Fi... » read more

‘What If’ In 3D
By Ed Sperling - 28 Apr, 2011 - Comments: 0

By Ed Sperling ‘What if’ questions have become standard across multiple pieces of the design chain for any SoC, but the number is multiplying at each new process node. When the industry begins moving to 2.5D and 3D over the next couple years, the number of tradeoffs will likely move from overwhelming to unmanageable. That will set in motion a number of efforts in semiconductor design. ... » read more

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