tag: Sony

Week In Review: Design, Low Power
By Jesse Allen - 30 Oct, 2020 - Comments: 0

M&A AMD will acquire Xilinx for $35 billion in an all-stock deal. "Joining together with AMD will help accelerate growth in our data center business and enable us to pursue a broader customer base across more markets,” said Victor Peng, Xilinx president and CEO. The deal is expected to close by the end of 2021. The acquisition of the programmable logic giant will leave only a few purepla... » read more

The Race To Much More Advanced Packaging
By Mark LaPedus - 23 Jul, 2020 - Comments: 2

Momentum is building for copper hybrid bonding, a technology that could pave the way toward next-generation 2.5D and 3D packages. Foundries, equipment vendors, R&D organizations and others are developing copper hybrid bonding, which is a process that stacks and bonds dies using copper-to-copper interconnects in advanced packages. Still in R&D, hybrid bonding for packaging provides mo... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 22 May, 2020 - Comments: 0

Edge, cloud, data center Cadence added new verification IP (VIP) for hyperscalar data centers that supports CXL – Compute Express Link, HBM3, and Ethernet 802.3ck. The VIP are part of Cadence’s Verification Suite. Cadence also released IP for 56G long-reach SerDes on TSMC’s N7 and N6 process technologies. Many Mentor, a Siemens Business, IC design tools are now certified TSMC’s N5 a... » read more

Scaling CMOS Image Sensors
By Mark LaPedus - 20 Apr, 2020 - Comments: 5

After a period of record growth, the CMOS image sensor market is beginning to face some new and unforeseen challenges. CMOS image sensors provide the camera functions in smartphones and other products, but now they are facing scaling and related manufacturing issues in the fab. And like all chip products, image sensors are seeing slower growth amid the coronavirus outbreak. Manufactured a... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 10 Apr, 2020 - Comments: 0

COVID-19/Medical Mentor's parent company Siemens is making its Additive Manufacturing (AM) Network, along with its 3D printers, available to the global medical community. MEMS is at the forefront of SARS-CoV-2 testing, writes Alissa M. Fitzgerald, founder of AMFitzgerald in a blog on SEMI.org. Fitzgerald points out a MEMS silicon PCR chip, developed by Northrup et. al. at Lawrence Livermore... » read more

New Ways To Optimize Machine Learning
By Bryon Moyer - 02 Apr, 2020 - Comments: 1

As more designers employ machine learning (ML) in their systems, they’re moving from simply getting the application to work to optimizing the power and performance of their implementations. Some techniques are available today. Others will take time to percolate through the design flow and tools before they become readily available to mainstream designers. Any new technology follows a basic... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Mar, 2020 - Comments: 0

The coronavirus (COVID-19) continues to have an impact on most, if not all, industries. This includes the electronics, semiconductor and related segments. International Data Corp. (IDC) has released a report on the company’s view on the impact the COVID-19 virus will have on the semiconductor market. The report provides a framework to evaluate the market impact through four scenarios. "... » read more

Logic Chip, Heal Thyself
By SE Staff - 11 Feb, 2020 - Comments: 0

If a single fault can kill a logic chip, that doesn’t bode well for longevity of complex multi-chip systems. Obsolescence in chips is not just an industry ploy to sell more chips. It is a fact of physics that chips don’t last more than a few years, especially if overheated, and hit with higher voltage than it can stand. The testing industry does a great job finding defects during manufac... » read more

The Race To Next-Gen 2.5D/3D Packages
By Mark LaPedus - 23 Sep, 2019 - Comments: 4

Several companies are racing each other to develop a new class of 2.5D and 3D packages based on various next-generation interconnect technologies. Intel, TSMC and others are exploring or developing future packages based on one emerging interconnect scheme, called copper-to-copper hybrid bonding. This technology provides a way to stack advanced dies using copper connections at the chip level,... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 20 Sep, 2019 - Comments: 0

Fab tools The confidence level of extreme ultraviolet (EUV) lithography continues to grow as the technology moves into production, but the EUV mask infrastructure remains a mixed picture, according to new surveys released by the eBeam Initiative. D2S has developed new hardware and software that enables a long-awaited technology--full-chip masks using inverse lithography technology (ILT). ... » read more

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