The Week In Review: Manufacturing

By Mark LaPedus - 25 Sep, 2015 - Comments: 0

Samsung Semiconductor unveiled its North American R&D Headquarters for its Device Solutions group in San Jose, Calif. The new campus is a 1.1 million-square-foot R&D, sales and marketing center. Is 5G the next big thing in wireless? Verizon–the first company to introduce 4G LTE–is once again poised to usher in a new era with an aggressive roadmap for fifth-generation, or 5G, wireless t... » read more

SEMICON Taiwan’s Packaging Punch

By SEMI - 17 Sep, 2015 - Comments: 0

SEMICON Taiwan packed a punch, setting several new records and new heights in 2015. This year marked the 20th anniversary of SEMICON in Taiwan and was the largest SEMICON in Taiwan ever, with a Nobel Prize winner (Professor Shuji Nakamura, 2014’s winner) keynoting the Executive Summit, Taiwan’s President Ma speaking at the hugely attended Gala Dinner, and 2015 on track for TSMC to be the wo... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 04 Sep, 2015 - Comments: 0

GlobalFoundries has partnered with Catena, a supplier of radio frequency (RF) communication IPs, to offer complete Wi-Fi and Bluetooth solutions for system-on-chip (SoC) designers targeting mobile, Internet-of-Things (IoT), RF connectivity markets. In addition, GlobalFoundries and QEOS are partnering to co-develop the industry’s first mmW CMOS platform. Samsung Electronics said that its 20... » read more

Is The Stacked Die Ecosystem Stagnating?

By Ann Mutschler - 18 Dec, 2014 - Comments: 2

It is now widely agreed that not much has been happening in terms of adoption for 2.5D interposer and 3D ICs. “It seems like everyone is still at the starting line waiting for the race to begin," said Javier DeLaCruz, senior director of engineering of [getentity id="22242" e_name="eSilicon"]. "Interposer assembly and IP availability for effectively using the [getkc id="82" comment="2.5D IC... » read more

Straight Talk On 3D TSVs

By Ed Sperling - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Semiconductor Manufacturing & Design sat down to discuss 3D device challenges and applications with John Lau, a fellow at the Industrial Technology Research Institute (ITRI), a research organization in Taiwan. SMD: What is ITRI doing in 3D TSVs? Lau: At ITRI we have developed the world’s first Applied Materials’ 300mm (3D TSV) integration line. The line was comple... » read more

Newer posts →

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SPIL

The Week In Review: Manufacturing

SEMICON Taiwan’s Packaging Punch

The Week In Review: Manufacturing

Is The Stacked Die Ecosystem Stagnating?

Straight Talk On 3D TSVs

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

2D Semiconductors Make Progress, But So Does Silicon

Knowledge Centers
Entities, people and technologies explored