Chip Industry Week In Review

By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

Chip Industry Talent Shortage Drives Academic Partnerships

By Liz Allan - 16 Oct, 2023 - Comments: 0

Universities around the world are forming partnerships with semiconductor companies and governments to help fill open and future positions, to keep curricula current and relevant, and to update and expand skills for working engineers. Talent shortages repeatedly have been cited as the number one challenge for the chip industry. Behind those concerns are several key drivers, and many more dom... » read more

Week In Review: Automotive, Security and Pervasive Computing

By Linda Christensen - 31 Mar, 2023 - Comments: 0

The Biden administration uncorked a fueling station locator tool to help consumers locate charging stations by fuel type, a plan to install 24,000 charging stations at federal facilities by next fiscal year, as well as other clean energy commitments. Source: Department of Energy: Alternative Fuels Data Center & Station Locator Europe is making progress on a plan that requires all ... » read more

Chip Industry’s Technical Paper Roundup: Mar. 28

By Linda Christensen - 28 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=89 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Tomorrow’s Semiconductor Workforce

By Raj Jammy - 16 Feb, 2023 - Comments: 1

With tens of billions directly allocated to spur growth in this essential industry, now is the time for us to focus on a critical challenge: ensuring that as this industry grows exponentially, we create a pipeline for the next generation of semiconductor workers, from the manufacturing floor to the design suites. The semiconductor industry’s growth will ripple throughout the nation, creating ... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 03 Feb, 2023 - Comments: 0

Imec released its semiconductor roadmap, which calls for doubling compute power every six months to handle the data explosion and new data-intensive problems. Imec named five walls (scaling, memory, power, sustainability, cost) that need to be dismantled. The roadmap (below) stretches from 7nm to 0.2nm (2 angstroms) by 2036, and includes four generations of gate-all-around FETs followed by thre... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 06 Jan, 2023 - Comments: 0

TSMC is in advanced talks with key suppliers about setting up its first potential European plant in Dresden, Germany, according to Nikkei Asia. The company held a 3nm volume production and capacity expansion ceremony at its Fab 18. TSMC also is building 3nm capacity at its Arizona site, as well as opening a global R&D Center in the Hsinchu Science Park in the second quarter of 2023, to be ... » read more

Week In Review: Design, Low Power

By Marie C. Baca - 06 Jan, 2023 - Comments: 0

Top Of The News Google announced it will support the RISC-V architecture with the Android open-source operating system. In a keynote at the RISC-V Summit, Lars Bergstrom, Google's director of engineering for the Android Platform Programming Languages, noted that Android currently has more than 3 billion users and the support of more than 24,000 vendors. "We've been following RISC-V for a very ... » read more

MTJ-based Circuits Provide Low-Cost, Energy Efficient Solution For Future Hardware Implementation in SC Algorithms

By Technical Paper Link - 30 Dec, 2022 - Comments: 0

A review paper titled "Review of Magnetic Tunnel Junctions for Stochastic Computing" was published by researchers at University of Minnesota Twin Cities. Funding agencies include Semiconductor Research Corporation (SRC), CAPSL, NIST, DARPA and others. Abstract: "Modern computing schemes require large circuit areas and large energy consumption for neuromorphic computing applications, such as... » read more

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tag: SRC

Chip Industry Week In Review

Chip Industry Talent Shortage Drives Academic Partnerships

Week In Review: Automotive, Security and Pervasive Computing

Chip Industry’s Technical Paper Roundup: Mar. 28

Week In Review: Semiconductor Manufacturing, Test

Tomorrow’s Semiconductor Workforce

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Design, Low Power

MTJ-based Circuits Provide Low-Cost, Energy Efficient Solution For Future Hardware Implementation in SC Algorithms

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