tag: SRC

The Week In Review: Manufacturing
By Mark LaPedus - 12 Sep, 2014 - Comments: 0

Front-end fab equipment spending is projected to increase by 20% in 2015 to $42 billion, according to SEMI. In 2015, equipment spending could mark a historical record high, surpassing the previous peak years of 2007 ($39 billion) and 2011 ($40 billion). In 2014, the report predicts growth of approximately 21% for front-end fab equipment spending, for total spending of $34.9 billion. SEMI rep... » read more

Plotting IBM Micro’s Future
By Mark LaPedus - 14 Aug, 2014 - Comments: 1

It’s been a wild ride for IBM’s Microelectronics Group. Neither IBM, nor the other parties involved, have made any public comments about the recent events concerning IBM Micro. Much of the drama has played out in the media. Based on those reports, here’s a rough outline of the events. Not long ago, IBM put its loss-ridden chip unit on the block to shore up the company’s bottom lin... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Feb, 2014 - Comments: 0

SPIE Advanced Lithography is a patterning show. At the event, however, Applied Materials revealed more details regarding its selective materials removal opportunity, according to Weston Twigg, an analyst with Pacific Crest Securities, in a research note. Applied Materials presented a paper entitled, “Where Is Plasma Etching Going from Here?” “The presenter outlined concepts for thin layer... » read more

Quantum Computer Race Heats Up
By Mark LaPedus - 20 Feb, 2014 - Comments: 0

For years, there has been an intense race among various nations to develop the world’s fastest supercomputers. The U.S. and Japan led the field until 2010, when China stunned the market and rolled out the world’s fastest supercomputer. And today, China continues to lead the field with a supercomputer capable of running at speeds of 33.86 petaflops per second. While the supercomputer race... » read more

Why Would IBM Sell Its Semi Group?
By Ed Sperling - 20 Feb, 2014 - Comments: 1

Rumors are always just rumors until proven otherwise in business, but in the case of IBM’s semiconductor business, hints about the sale of its semiconductor business are particularly noteworthy. Much has changed since the days when IBM—as International Business Machines—went head-to-head with AT&T’s quasi-public Bell Labs and Xerox’s Palo Alto Research Center (PARC). The breakup of... » read more

What’s After CMOS?
By Mark LaPedus - 24 Jan, 2014 - Comments: 3

Chipmakers continue to scale the CMOS transistor to finer geometries, but the question is for how much longer. The current thinking is that the CMOS transistor could scale at least to the 3nm node in the 2021 timeframe. And then, CMOS could run out of gas, prompting the need for a new switch technology. So what’s after the CMOS-based transistor? Carbon nanotubes and graphene get the most a... » read more

Week In Review: Manufacturing & Design
By Mark LaPedus - 25 Oct, 2013 - Comments: 0

Don’t look now, but Intel is expanding its foundry business. Previously, Intel garnered a small collection of foundry customers. But Intel would not entertain foundry customers that had competitive products based on ARM chips. Apparently, Intel is having a change of heart. “I think they’ve changed their position,” said Nathan Brookwood, a research fellow at Insight 64. “They will do A... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

The Ins And Outs Of Directed Self-Assembly
By Ed Sperling - 26 Jun, 2012 - Comments: 0

By Mark LaPedus H.S. Phillip Wong, professor of electrical engineering at Stanford University and one of the leading experts on directed self-assembly (DSA) technology, sat down to discuss the future of this approach with Semiconductor Manufacturing & Design. With funding from the Semiconductor Research Corp. (SRC), Stanford is exploring contact-hole patterning and the design infrastructur... » read more

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