tag: standards

AUTOSAR And FlexRay
By Mentor, a Siemens Business - 05 Mar, 2015 - Comments: 0

This paper describes ways tools are quickly becoming the foundation for optimization processes that help engineers design profitable automotive products more efficiently than ever before. Standards are the enabling platform for the modern computer-based design tools that have transformed industries around the world. AUTOSAR is a leading effort to bring some standardization to the software platf... » read more

Feathers Ruffled By IEEE Patent License Changes
By Brian Bailey - 26 Feb, 2015 - Comments: 0

Standards are essential for any market to grow. Products that are completely proprietary tend to serve small niche markets whereas those based on standards can grow through collaborations, independent content creation, and many other ways. Just think about where we would be if there were no communications standards – no WiFi, no cellular standards. You would be locked into buying all of your ... » read more

Blog Review: Feb. 18
By Jesse Allen - 18 Feb, 2015 - Comments: 0

Ansys' Justin Nescott digs up the top five engineering articles of the week. A thermal mapping microwave may make finding cold centers in nuked food a thing of the past. Plus, in hospitals your next meal might be delivered by a robot. Worried about your car being hacked? Maybe you should be. Mentor's John Day pulls out important points from the recent security report on wireless-enabled vehi... » read more

Accellera Adds Portable Stimulus Group
By Brian Bailey - 11 Feb, 2015 - Comments: 0

[getentity id="22028" e_name="Accellera"] created a working group for the portable test and stimulus, which would allow engineering teams to create the test once and be able to run it throughout the flow. This is a big deal in verification because it allows horizontal reuse of a [getkc id="55" kc_name="testbench"]. Test patterns run on the processors in a design and that enables the test to ... » read more

Si2 Leadership Change
By Ann Mutschler - 03 Feb, 2015 - Comments: 0

Steve Schulz, who had been president and CEO of standards body Si2 for the past 12 years has resigned from the organization, Semiconductor Engineering learned today. He said he has thoroughly enjoyed the 12-1/2 years that he was with Si2 and is very, very proud of the successes from rebuilding it when he first joined and all of the growth the organization has had. “I still have a lot o... » read more

Unraveling Power Methodologies
By Brian Bailey - 15 Jan, 2015 - Comments: 0

When working on articles, the editors at Semiconductor Engineering sometimes hear things that make them stand back and question what seems to be an industry truth. One such statement happened last month while researching a different article. The statement was: Most designs are not top-down, but in fact bottom-up when it comes to power management. The most used methodology today is that the RTL... » read more

Image Sensor And Display Enhancements Drive Low-Cost Smartphone Growth
By Hezi Saar - 15 Jan, 2015 - Comments: 0

The low-cost smartphone segment is fueling the growth of the overall smartphone market. Smartphones are being adopted in emerging markets and are displacing feature or basic phones in developed markets. Mobile phone device manufacturers are closing the leadership gap with the No. 1 vendor – Samsung – by competing in both the high-end and low-end smartphone segments. See Table 1. Table ... » read more

Important Changes Ahead
By Steve Schulz - 12 Jan, 2015 - Comments: 0

Two of Si2's important industry standards efforts will be featured later this month at DesignCon, a popular Silicon Valley event that is now in its 20th year. In the panel entitled, "System-Level Power Modeling—What's the Big Deal?", leading industry experts from AMD, Avago Technologies, Cadence, Docea Power, Qualcomm, and Si2 will focus on the growing need to take a higher level and more... » read more

Security Risks Grow Worse
By Ed Sperling - 30 Dec, 2014 - Comments: 0

Semiconductor Engineering sat down to discuss security issues for connected devices with Marc Canel, vice president of security at [getentity id="22186" comment="ARM"]; Paul Kocher, president and chief scientist for the Cryptography Research division of [getentity id="22671" e_name="Rambus"]; Michael Poitner, global segment marketing manager at [getentity id="22499" e_name="NXP"]; Felix Baum, h... » read more

See The Internet Of Things…In 3D
By Steve Schulz - 05 Dec, 2014 - Comments: 0

No, you don’t need 3D glasses to experience two of the hottest emerging technology trends in electronics — just take advantage of the longest running conference series on the topic of 3-D integrated circuits. Now in its 11th year, the 3D Architectures for Semiconductor Integration and Packaging conference will take place in San Francisco next week. The event will feature two pre-conference ... » read more

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