3D-IC Standardization Progress Continues


Since its formation in December 2010, the SEMI 3DS-IC Standards Committee has made significant progress in establishing key standards in areas such as TSV metrology, glass carrier wafers, and terminology. The committee’s two newest standards are SEMI 3D6-0913 - Guide for Chemical Mechanical Planarization (CMP) and Micro-Bump Processes for Frontside Through Silicon Via (TSV) Integration, and S... » read more

From DFM To IFM


For the past decade the bridge between design and manufacturing was called, appropriately enough, design for manufacturing. DFM tools, which by nature cross boundaries of what previously were discrete segments in the semiconductor flow, are now critical for complex designs. They allow design teams to check early in the design process whether chips will yield sufficiently and to incorporate rule... » read more

The Week In Review: System-Level Design


Si2’s OpenPDK rolled out its Open Process Specification 1.1, including elements necessary to automatically create a process design kit using any EDA vendor’s design flow. The standard uses formal grammar based on the XML Schema Definition. ARM won a deal with Rockchip, which is extending its license to a number of ARM processors as well as its GPU and interconnect technology. This marks ... » read more

The Week In Review: Manufacturing & Design


GT Advanced Technologies has entered into a multi-year supply agreement with Apple for sapphire materials. GT will own and operate its furnaces and related equipment to produce the sapphire materials at an Apple-owned facility in Arizona. GT expects to employ more than 700 people in the facility. Apple will provide GT with a prepayment of about $578 million. “We believe Apple likely has signi... » read more

The Problem With EDA Standards


In the EDA industry, does standard mean the same as it does in most industries? The Free Dictionary defines it as: Something, such as a practice or a product, that is widely recognized or employed, especially because of its excellence. In the EDA industry, a standards body is the place where EDA companies and customers come together to try and bring about convergence, often in a new or emerging... » read more

Huge Challenges With Billions Of Things


Communication is poised in the next couple of years to cross a line between humans and things—things talking directly to other things as well as to people—setting in motion a series of technological, social and legal issues that will take years or decades to resolve. On one hand, this is made possible by leaps in processing performance and power management in mobile devices. In his keyno... » read more

Lessons From The Big Apple


Apple this week announced some big changes in their product lineup. Having already released their MacBook Air with the power-sipping Intel Haswell processor, Apple has made further strides with an operating system upgrade that extends battery life by yet another 10% to 15%. For those deep into technology, you may already know that low-power design capability wasn’t created overnight. It h... » read more

Standards Watch


This may sound odd to anyone outside of the SoC world, but as more functionality and more components move from PCB to chip—or at least the same package—what’s happening in the standards world is mirroring what’s going on in semiconductor design and manufacturing. The rule of thumb in the standards world is that as new techniques and technologies are introduced, the number of standard... » read more

Experts At The Table: 450mm Fab And Facilities Challenges


Semiconductor Manufacturing & Design sat down to discuss future 450mm fab and facilities challenges with Gerald Goff, director of the project management office for fab design and construction at GlobalFoundries; Joe Cestari, president of Total Facility Solutions; Ivo Raaijmakers, chief technology officer of ASM International; and Michael Brain, senior director of the Fab Solutions Business... » read more

More Efficient Things


By Qi Wang There are many angles to consider when it comes to efficiency and the Internet of Things (IoT). At the architectural level, the IoT system consists of connected things, the networks and the cloud servers for massive data processing. Efficient data storage and servers means lower power consumption, which will result in millions of dollars in savings. For the connected things thems... » read more

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