tag: State University of New York

Chip Industry’s Technical Paper Roundup: October 24
By Liz Allan - 24 Oct, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=157 /] More Reading Technical Paper Library home » read more

Chip Industry Week In Review
By The SE Staff - 20 Oct, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan SRC unfurled its Microelectronics and Advanced Packaging (MAPT) industry-wide 3D semiconductor roadmap, addressing such topics as advanced packaging, heterogeneous integration, analog and mixed-signal semiconductors, energy efficiency, security, the related foundational ecosystem, and more. The guidance is the collective effort of 300 individuals ... » read more

A Study Of LLMs On Multiple AI Accelerators And GPUs With A Performance Evaluation
By Technical Paper Link - 19 Oct, 2023 - Comments: 0

A technical paper titled “A Comprehensive Performance Study of Large Language Models on Novel AI Accelerators” was published by researchers at Argonne National Laboratory, State University of New York, and University of Illinois. Abstract: "Artificial intelligence (AI) methods have become critical in scientific applications to help accelerate scientific discovery. Large language models (L... » read more

Multi-Layer Attack Graph Analysis in the 5G Edge Network Using a Dynamic Hexagonal Fuzzy Method
By Technical Paper Link - 10 Jan, 2022 - Comments: 0

Abstract "Overall, 5G networks are expected to become the backbone of many critical IT applications. With 5G, new tech advancements and innovation are expected; 5G currently operates on software-defined networking. This enables 5G to implement network slicing to meet the unique requirements of every application. As a result, 5G is more flexible and scalable than 4G LTE and previous generations... » read more

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