Week in Review: Iot, Security, Automotive

By Susan Rambo - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Service Revenue Growing With Chip Complexity

By Ann Mutschler - 04 Nov, 2019 - Comments: 0

Rising complexity, new markets, and a shortage of in-house expertise are beginning to rekindle demand for services for the first time in nearly a decade. The semiconductor industry has been racing to design chips for a variety of new and existing applications, but they are facing challenges on a number of fronts: Leading-edge chips require new architectures due to a sharp reduction in s... » read more

Manufacturing Bits: Oct. 22

By Mark LaPedus - 22 Oct, 2019 - Comments: 0

3.5D chip packaging In a recent paper, PacTech has described a vertical laser assisted bonding process for use in developing advanced 3.5D chip packages. Laser assisted bonding (LAB) is an interconnection technology used in IC packaging. It uses a laser as a thermal energy, which in turn connects a die bump and a substrate pad, according to Amkor, which is the original developer of LAB tech... » read more

SiC Market Moves Into Overdrive

By Mark LaPedus - 19 Sep, 2019 - Comments: 0

The silicon carbide (SiC) power semiconductor market continues to heat up in the automotive arena. In recent times, several automotive OEMs have formed a series of alliances with SiC device makers, and for good reason. In a major way, many automotive OEMs are entering or expanding their efforts in the battery-electric car market. SiC power semiconductors are among the key components used ... » read more

Hybrid Emulation Takes Center Stage

By Ann Mutschler - 25 Jul, 2019 - Comments: 0

From mobile to networking to AI applications, system complexity shows no sign of slowing. These designs, which may contain multiple billion gates, must be validated, verified and tested, and it’s no longer possible to just throw the whole thing in a hardware emulator. For some time, emulation, FPGA-based prototyping, and virtual environments such as simulators have given design and verific... » read more

What’s Next In Advanced Packaging

By Mark LaPedus - 20 Jun, 2019 - Comments: 3

Packaging houses are readying the next wave of advanced IC packages, hoping to gain a bigger foothold in the race to develop next-generation chip designs. At a recent event, ASE, Leti/STMicroelectronics, TSMC and others described some of their new and advanced IC packaging technologies, which involve various product categories, such as 2.5D, 3D and fan-out. Some new packaging technologies ar... » read more

Wrestling With High-Speed SerDes

By Ann Mutschler - 19 Jun, 2019 - Comments: 2

SerDes has emerged as the primary solution in chips where there is a need for fast data movement and limited I/O, but this technology is becoming significantly more challenging to work with as speeds continue to rise to offset the massive increase in data. A Serializer/Deserializer is used to convert parallel data into serial data, allowing designers to speed up data communication without h... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 14 Jun, 2019 - Comments: 0

Products/Services Mentor, a Siemens Business, announced the release of the final phase of the Valor software New Product Introduction design-for-manufacturing technology, automating printed circuit board design reviews. The company has integrated DFM technology into the Xpedition software layout application. Arteris IP reports that Toshiba has taped out its next-generation advanced driv... » read more

Inspection, Metrology Challenges Grow For SiC

By Mark LaPedus - 11 Jun, 2019 - Comments: 2

Inspection and metrology are becoming more critical in the silicon carbide (SiC) industry amid a pressing need to find problematic defects in current and future SiC devices. Finding defects always has been a challenging task for SiC devices. But it’s becoming more imperative to find killer defects and reduce them as SiC device vendors begin to expand their production for the next wave of a... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 May, 2019 - Comments: 0

Internet of Things Paris-based Parrot Drones and five other companies were selected by the Pentagon’s Defense Innovation Unit and the U.S. Army to adapt off-the-shelf commercial drones for combat applications as part of the Army’s Short Range Reconnaissance program. SRR seeks to develop unmanned aerial vehicles that have a flight time of 30 minutes, a range of three kilometers (nearly two ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: STMicroelectronics

Week in Review: Iot, Security, Automotive

Service Revenue Growing With Chip Complexity

Manufacturing Bits: Oct. 22

SiC Market Moves Into Overdrive

Hybrid Emulation Takes Center Stage

What’s Next In Advanced Packaging

Wrestling With High-Speed SerDes

Week in Review: IoT, Security, Auto

Inspection, Metrology Challenges Grow For SiC

Week in Review: IoT, Security, Auto