tag: STMicroelectronics

ARM Cortex-A53, UPF & FD-SOI
By Barry Pangrle - 07 Nov, 2013 - Comments: 0

The IEEE Standards Association Symposium on Electronic Design Automation (EDA) Interoperability was held on Oct. 24. I found the first session, Interoperability Challenges: Power Management in Silicon, with presentations by Erich Marschner of Mentor Graphics and Stuart Riches and Adnan Khan (both from ARM) to be particularly interesting. Earlier this year, the IEEE announced a new version of UP... » read more

Experts At The Table: What’s Missing In The IoT
By Ed Sperling - 07 Nov, 2013 - Comments: 0

Semiconductor Engineering sat down to discuss the future of the IoT with Oleg Logvinov, director of market development for STMicroelectronics’ Industrial and Power Conversion Division; Martin Lund, senior vice president of the IP Group at Cadence; Naveed Sherwani, president and CEO of Open-Silicon; and Damon Hernandez, a member of the Web3D Consortium. What follows are excerpts of that conver... » read more

The Week In Review: Manufacturing & Design
By Mark LaPedus - 01 Nov, 2013 - Comments: 0

Silver surfers represent a more important technology market than “Generation X” and “Generation Y,” according to research from Gartner. Silver surfers are people in middle age or approaching old age. Although most technologists fail to recognize this fact, they are very interested in using technology and also have the time and the resources to pursue their interests, according to Gartne... » read more

Week In Review: Manufacturing & Design
By Mark LaPedus - 25 Oct, 2013 - Comments: 0

Don’t look now, but Intel is expanding its foundry business. Previously, Intel garnered a small collection of foundry customers. But Intel would not entertain foundry customers that had competitive products based on ARM chips. Apparently, Intel is having a change of heart. “I think they’ve changed their position,” said Nathan Brookwood, a research fellow at Insight 64. “They will do A... » read more

The Week In Review: Oct. 11
By Mark LaPedus - 11 Oct, 2013 - Comments: 0

By Mark LaPedus & Ed Sperling Demand is running high for DRAMs, thanks to last month’s fab fire at Hynix’ China plant. “The impact from Hynix' fab fire seems to be far more extensive than we had originally thought. We now think the factory is most likely up at the earliest by May/June 2014, which certainly provides robust pricing support for DRAM. Hynix is in the process of convertin... » read more

The Week In Review: Oct. 4
By Mark LaPedus - 04 Oct, 2013 - Comments: 0

By Mark LaPedus & Ed Sperling eSilicon introduced an automated multi-project wafer quote system, which allows companies to sort through a number of options and get pricing. The quotes are tied into TSMC's 20nm to 350nm processes, and GlobalFoundries’ 20nm to 180nm processes. The approach eliminates the need for companies to buy a full wafer if their volume requirements don’t warrant it... » read more

Viable Choices Ahead
By Ed Sperling - 27 Sep, 2013 - Comments: 0

Two years ago—basically one process node back, wherever companies were on the Moore’s Law road map—there was confusion about what lies ahead and what is the best way to proceed. During that time, three very viable options have been proven to work. Some already are in silicon, while others are coming very soon. The first is the finFET. At the very leading edge of the road map, finFET... » read more

Under One Roof
By Ed Sperling - 12 Sep, 2013 - Comments: 0

By Ed Sperling Microsoft’s decision to buy Nokia’s phone business, Apple’s move to build its own chips to more effectively run its software, and Google’s effort to develop its own hardware for next-generation platforms such as Google Glass mark an interesting reversal in the electronics industry. Disaggregation was the answer to slow-moving giants such as big-iron companies. Startin... » read more

Materials, Software And Techniques
By Ed Sperling - 26 Jul, 2013 - Comments: 0

The future of advanced semiconductor technology is about to split evenly into three different areas. On the leading edge of manufacturing, Applied Materials CEO Mike Splinter called it correctly—it’s all about materials. Just shrinking features isn’t buying much anymore. In fact, at advanced nodes, with extra margin built into designs, it frequently doesn’t buy anything except extra ... » read more

Foundries Eye 300mm Analog Fabs
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

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