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Making Chip Packaging More Reliable


Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Controlling The Reliability Of Silicon Carbide-Based Devices


The development of wide bandgap silicon carbide (SiC) compound semiconductors has proved to be extremely beneficial for power conversion applications. Capable of switching at significantly higher frequencies, and with higher breakdown voltage characteristics, SiC power transistors are quickly becoming an attractive silicon alternative for high power density and/or high-efficiency power conver... » read more