Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)

By Technical Paper Link - 31 May, 2024 - Comments: 0

A technical paper titled “Comparative Analysis of Thermal Properties in Molybdenum Substrate to Silicon and Glass for a System-on-Foil Integration” was published by researchers at Rochester Institute of Technology and Lux Semiconductors. Abstract: "Advanced electronics technology is moving towards smaller footprints and higher computational power. In order to achieve this, advanced packag... » read more

A Benchmark Study Of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

By Coventor - 17 Jun, 2020 - Comments: 0

Sub-5 nm logic nodes will require an extremely high level of innovation to overcome the inherent real-estate limitations at this increased device density. One approach to increasing device density is to look at the vertical device dimension (z-direction), and stack devices on top of each other instead of conventionally side-by-side. The fabrication of a Complementary-Field Effect Transistor (CF... » read more

GDDR6 – HBM2 Tradeoffs

By Ed Sperling - 10 Apr, 2019 - Comments: 0

Steven Woo, Rambus fellow and distinguished inventor, talks about why designers choose one memory type over another. Applications for each were clearly delineated in the past, but the lines are starting to blur. Nevertheless, tradeoffs remain around complexity, cost, performance, and power efficiency. Related Video Latency Under Load: HBM2 vs. GDDR6 Why data traffic and bandw... » read more

Planarization Challenges At 7nm And Beyond

By Ed Sperling - 10 Dec, 2018 - Comments: 0

Dan Sullivan, executive director of semiconductor technology at Brewer Science, digs into the challenges of planarizing a thin film on a wafer for etch and optical control. The problem becomes more difficult at advanced nodes because the films are thinner. https://youtu.be/iNA6EGpoYZU _________________________________ See more tech talk videos here » read more

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tag: substrate

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)

A Benchmark Study Of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

GDDR6 – HBM2 Tradeoffs

Planarization Challenges At 7nm And Beyond

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tag: substrate

Comparing Thermal Properties In Molybdenum Substrate To Si And Glass For A System-On-Foil Integration (RIT, Lux)

A Benchmark Study Of Complementary-Field Effect Transistor (CFET) Process Integration Options: Comparing Bulk vs. SOI vs. DSOI Starting Substrates

GDDR6 – HBM2 Tradeoffs

Planarization Challenges At 7nm And Beyond

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

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