tag: Sungkyunkwan University

Chip Industry Technical Paper Roundup: Feb. 4
By Linda Christensen - 04 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=403 /] Find all technical papers here. » read more

Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Understand LWR (Samsung, ASML)
By Technical Paper Link - 29 Jan, 2025 - Comments: 0

A new technical paper titled "Controlling Speckle Contrast Using Existing Lithographic Scanner Knobs to Explore the Impact on Line Width Roughness" was published by researchers at Samsung, ASML and Sungkyunkwan University. Abstract "Local critical dimension uniformity (LCDU) or line width roughness (LWR) is increasingly important in argon fluoride (ArF) immersion lithography systems (scanne... » read more

Research Bits: Jan. 20
By Jesse Allen - 20 Jan, 2025 - Comments: 0

Self-correcting memristor array Researchers at Korea Advanced Institute of Science and Technology (KAIST), Seoul National University, Sungkyunkwan University, Electronics and Telecommunications Research Institute (ETRI), and Yonsei University developed a memristor-based neuromorphic chip that can learn and correct errors, enabling it to adapt to immediate environmental changes. The system c... » read more

Research Bits: Dec. 24
By Jesse Allen - 24 Dec, 2024 - Comments: 0

Growing multilayered chips Researchers from MIT, Samsung Advanced Institute of Technology, Sungkyunkwan University, and University of Texas at Dallas developed a method to fabricate a multilayered chip with alternating layers of semiconducting material grown directly on top of each other. The approach enables high-performance transistors and memory and logic elements on any random crystalline ... » read more

Asia Government Funding Surges
By Liz Allan - 18 Nov, 2024 - Comments: 0

Billions of dollars have been pouring into Asian countries for the past few years in an effort to boost their production capacity, explore leading-edge technology, compete on the global stage, and shore up supply chains in the face of geopolitical turmoil. Each country has its own plan to maintain a foothold in the global market, from China’s Big Fund to Korea’s Yongin Cluster and Japan�... » read more

Chip Industry Technical Paper Roundup: Oct. 14
By Linda Christensen - 14 Oct, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=367 /] More Reading Chip Industry Week In Review AI CPU chiplet platform; Intel-AMD pact; GDDR7 DRAM; AI-RFIC funding; CHIPS Act awards; NoC tiling; thermal modeling on chiplets; $900M nuclear tech and more. Technical Paper Library home » read more

Improving The Gate Oxide Reliability in Gate First HKMG DRAM Structures (Sungkyunkwan Univ., Samsung)
By Technical Paper Link - 11 Oct, 2024 - Comments: 0

A new technical paper titled "Novel STI Technology for Enhancing Reliability of High-k/Metal Gate DRAM" was published by researchers at Sungkyunkwan University and Samsung Electronics. Abstract: "The challenges associated with semiconductor are increasing because of the rapid changes in the semiconductor market and the extreme scaling of semiconductors, with some processes reaching their te... » read more

Chip Industry Technical Paper Roundup: Sept. 3
By Linda Christensen - 03 Sep, 2024 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=256 /] More ReadingTechnical Paper Library home » read more

Benefits Of The Ultra-Low Leakage Currents from IGZO TFTs For Neuromorphic Applications
By Technical Paper Link - 27 Aug, 2024 - Comments: 0

A new technical paper titled "A tunable multi-timescale Indium-Gallium-Zinc-Oxide thin-film transistor neuron towards hybrid solutions for spiking neuromorphic applications" was published by researchers at imec, CSIC Universidad de Sevilla, and Sungkyunkwan University. Abstract "Spiking neural network algorithms require fine-tuned neuromorphic hardware to increase their effectiveness. Such ... » read more

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

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