Chip Industry Week In Review

By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

The Rise Of Generative AI On The Edge

By Gordon Cooper - 03 Apr, 2025 - Comments: 0

Artificial intelligence (AI) and machine learning (ML) have undergone significant transformations over the past decade. The revolution of convolutional neural networks (CNNs) and recurrent neural networks (RNNs) is evolving toward the adoption of transformers and generative AI (GenAI), marking a pivotal shift in the field. This transition is driven by the need for more accurate, efficient, and ... » read more

2024 Security IP Year In Review: Innovations And Best Practices

By Synopsys - 03 Apr, 2025 - Comments: 0

This booklet offers six insightful articles on advanced security IP technologies, helping to fortify digital systems against emerging threats. Learn about: DDR Interface Security: Defend against DRAM attacks. IoT Security: Safeguard IoT devices with SIM and Root of Trust. SRAM PUF Technology: Secure device authentication. Post-Quantum Cryptography: Protect against quantum threa... » read more

Auto Sector Leads The Way In IC Security

By Ann Mutschler - 03 Apr, 2025 - Comments: 0

Concerns about chip and system security are beginning to bear fruit in some markets, driven by the overlap in safety and security in automotive applications and the growing value of algorithms and complex systems in others. But how and when that security is implemented is still all over the map, and so is its effectiveness. The reasons are as nuanced as the designs themselves, which makes it... » read more

Chip Aging Opens Up New Attack Vectors

By Adam Kovac - 03 Apr, 2025 - Comments: 0

The longer a piece of silicon is out in the field the more prone it becomes to a cyberattack, raising questions about the optimal longevity of circuits and the impact of extending their lifetimes. This is particularly challenging for safety- and mission-critical applications, where the cost of development can run as high as $100 million for some of the most complex designs. Chipmakers want t... » read more

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Benefits And Challenges In Multi-Die Assemblies

By Ed Sperling And Laura Peters - 02 Apr, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chiplets, hybrid bonding, and new materials with Michael Kelly, vice president of Chiplets and FCBGA Integration at Amkor; William Chen, fellow at ASE; Dick Otte, CEO of Promex Industries; and Sander Roosendaal, R&D director at Synopsys Photonics Solutions. What follows are excerpts of that discussion. To view part one of t... » read more

Blog Review: Apr. 2

By Jesse Allen - 02 Apr, 2025 - Comments: 0

Synopsys’ Meenakshy Ramachandran explores how DisplayPort Automotive Extensions help meet functional safety and security standards for the increasingly higher-resolution and more immersive in-vehicle displays in connected, autonomous, shared, and electric vehicles. Siemens’ Gabriella Leone and Michael Munsey discuss the need for a collaborative semiconductor business platform and how to ... » read more

Challenges In Managing Chiplet Resources

By Ann Mutschler - 27 Mar, 2025 - Comments: 0

Managing chiplet resources is emerging as a significant and multi-faceted challenge as chiplets expand beyond the proprietary designs of large chipmakers and interact with other elements in a package or system. Poor resource management in chiplets adds an entirely new dimension to the usual power, performance, and area tradeoffs. It can lead to performance bottlenecks, because as chiplets co... » read more

First-Time Silicon Success Plummets

By Ed Sperling - 27 Mar, 2025 - Comments: 0

First-time silicon success is falling sharply due to rising complexity, the need for more iterations as chipmakers shift from monolithic chips to multi-die assemblies, and an increasing amount of customization that makes design and verification more time-consuming. Details from a new functional verification survey[1] highlight the growing difficulty of developing advanced chips that are both... » read more

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