tag: Synopsys

2025: So Many Possibilities
By Brian Bailey - 16 Jan, 2025 - Comments: 0

The stage is set for a year of innovation in the chip industry, unlike anything seen for decades, but what makes this period of advancement truly unique is the need to focus on physics and real design skills. Planar scaling of SoCs enabled design and verification tools and methodologies to mature on a relatively linear path, but the last few years have created an environment for more radical... » read more

What’s The Best Way To Sell An Inference Engine?
By Bryon Moyer - 16 Jan, 2025 - Comments: 0

The burgeoning AI market has seen innumerable startups funded on the strength of their ideas about building faster, lower-power, and/or lower-cost AI inference engines. Part of the go-to-market dynamic has involved deciding whether to offer a chip or IP — with some newcomers pivoting between chip and IP implementations of their ideas. The fact that some companies choose to sell chips while... » read more

Achieving Successful Timing, Power, And Physical Signoff For Multi-Die Designs
By Synopsys - 15 Jan, 2025 - Comments: 0

Multi-die designs using 2.5D and 3D technologies are increasingly important for a wide range of electronics applications, including high-performance computing (HPC), artificial intelligence (AI), automotive, and mobile. The multi-die architecture enables designers to mix dies from different foundries and technology nodes, including existing dies from previous projects. The resulting density and... » read more

AI Won’t Replace Subject Matter Experts
By Adam Kovac - 15 Jan, 2025 - Comments: 0

Experts at The Table: The emergence of LLMs and other forms of AI has sent ripples through a number of industries, raising fears that many jobs could be on the chopping block, to be replaced by automation. Whether that’s the case in semiconductors, where machine learning has become an integral part of the design process, remains to be seen. Semiconductor Engineering sat down with a panel of e... » read more

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2025 - Comments: 0

Siemens EDA's Stephen V. Chavez argues that the placement of decoupling capacitors on a PCB can make or break a design's power delivery system and provides some best practices and design considerations, such as ensuring even distribution on a board rather than crowding them around chips. Synopsys' Stelios Diamantidis predicts that in 2025, AI agents will begin collaborating with other AI age... » read more

DFT At The Leading Edge
By Gregory Haley - 14 Jan, 2025 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss the rapidly changing landscape of design for testability (DFT), focusing on the impact of advancements in fault models, high-speed interfaces, and lifecycle data analytics, with Jeorge Hurtarte, senior director of product marketing in the Semiconductor Test Group at Teradyne; Sri Ganta, director of test products at Synopsys; D... » read more

Chip Industry Week In Review
By The SE Staff - 10 Jan, 2025 - Comments: 0

Global semiconductor sales hit $57.8 billion in November 2024, an increase of 20.7% compared to the same month last year, according to the Semiconductor Industry Association. In U.S. government news: The U.S. Department of Commerce finalized up to $325 million in CHIPS Act funding for Hemlock Semiconductor, which will support construction of a new semiconductor-grade polysilicon manufac... » read more

Edge And IoT Security Turning A Corner
By Ed Sperling - 09 Jan, 2025 - Comments: 0

Security is beginning to improve for a wide range of IoT and edge devices due to better tools, the implementation of new standards and methodologies, and an increasing level of collaboration and communication across different market segments that in the past had little or no interaction. Until recently, many vendors in cost-sensitive markets offered the bare minimum of security. To make matt... » read more

How Software-Defined Vehicles Change Auto Chip Design
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The shift to software-defined vehicles is changing nearly every aspect of automotive design, from what hardware is added into vehicles, when it gets added, and what gets left behind. Moving key features to software rather than hardware allows carmakers to bring new features to market faster, at a lower cost, and to modify those features more quickly. It is also expected to drive up the value... » read more

ISO 26262’s Importance Widens Beyond Automotive
By Adam Kovac - 09 Jan, 2025 - Comments: 0

The ISO 26262 standard, which has become a mainstay since the trend toward vehicle electrification really took root a decade ago, is starting to gain traction in markets outside of automotive chip and system design. At the center of this expansion is a focus on safety under a variety of conditions — extreme temperatures, unexpected vibration, or a collision that is unavoidable. This includ... » read more

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