Week In Review: Design, Low Power


Siemens will acquire Supplyframe, a supply chain intelligence, sourcing, and marketplace platform for the electronics industry, for $700 million. The company operates on a software-as-a-service model and will serve as the nucleus of Siemens’ digital marketplace strategy, according to Cedrik Neike, member of the Managing Board of Siemens AG. “Supplyframe’s ecosystem and marketplace intelli... » read more

Week In Review: Auto, Security, Pervasive Computing


Pervasive computing — IoT, edge, cloud, data center, and back Combining AI with IoT not only gives another acronym AIoT, or Artificial Intelligence of Things, but it puts AI systems on the edge. Infineon Technologies has released its ModusToolbox Machine Learning to make it possible to run deep learning-based workloads on Infineon’s PSoC microcontrollers. The toolbox has middleware, softwa... » read more

Managing Wafer Retest


Every wafer test touch-down requires a balance between a good electrical contact and preventing damage to the wafer and probe card. Done wrong, it can ruin a wafer and the customized probe card and result in poor yield, as well as failures in the field. Achieving this balance requires good wafer probing process procedures as well as monitoring of the resulting process parameters, much of it ... » read more

Blog Review: May 19


Cadence's Paul McLellan checks out a project from Intel and DARPA to combine the eASIC structured ASIC technology with data interface chiplets and enhanced security protection, with manufacturing in the U.S. In a podcast, Siemens EDA's Ellie Burns and Michael Fingeroff discuss the gap between what the best AI applications can perform today versus the human brain and the challenges that hardw... » read more

Power Optimization: What’s Next?


Concerns about the power consumed by semiconductors has been on the rise for the past couple of decades, but what can we expect to see coming in terms of analysis and automation from EDA companies, and is the industry ready to make the investment? Ever since Dennard scaling stopped providing automatic power gains by going to a smaller geometry, circa 2006, semiconductors have been increasing... » read more

Week In Review: Design, Low Power


Siemens Digital Industries Software acquired Fractal Technologies, a provider of tools for IP validation and comparison checks of standard cell libraries, IO, and hard IP that reports mismatches or modeling errors, as well as comparing new IP releases close to tape-out. Siemens plans to add Fractal’s technology to the Xcelerator portfolio, joining the Solido software product family, which inc... » read more

Week In Review: Auto, Security, Pervasive Computing


Security A ransomware attack shutdown 5,500 miles of gas pipeline in the eastern United States for a week and sparked some panic buying and an executive order from U.S. President Biden. The Colonial Pipeline Co. paid nearly $5 million in ransom to Eastern European hackers, according to Bloomberg article. The hacker group DarkSide was responsible, members of whom the U.S. government believes li... » read more

11 Ways To Reduce AI Energy Consumption


As the machine-learning industry evolves, the focus has expanded from merely solving the problem to solving the problem better. “Better” often has meant accuracy or speed, but as data-center energy budgets explode and machine learning moves to the edge, energy consumption has taken its place alongside accuracy and speed as a critical issue. There are a number of approaches to neural netw... » read more

Early Detection Of Reset Domain Crossing Errors


Many aspects of system-on-chip (SoC) designs are growing, including the numbers of gates, memories, clock domains, reset domains, power domains, on-chip buses, and external interfaces. A recent blog post focused on reset domain crossings (RDCs) and the requirements for effective pre-silicon verification of these trouble-prone structures. If properly applied, a solution meeting these requirement... » read more

HBM Takes On A Much Bigger Role


High-bandwidth memory is getting faster and showing up in more designs, but this stacked DRAM technology may play a much bigger role as a gateway for both chiplet-based SoCs and true 3D designs. HBM increasingly is being viewed as a way of pushing heterogenous distributed processing to a completely different level. Once viewed as an expensive technology that only could be utilized in the hig... » read more

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