tag: Synopsys

Early, Accurate, Signoff-Correlated Power Analysis
By Synopsys - 21 Apr, 2021 - Comments: 0

Power estimation has always been a fundamental part of semiconductor development, but it has grown in importance in recent years. Virtually every application domain has power limitations that must be satisfied before a chip is fabricated. There is no effective way to fix power issues in the lab or in the field, so pre-silicon estimation must be accurate. The short development cycles for many ty... » read more

Next-Gen Design Challenges
By Ed Sperling - 20 Apr, 2021 - Comments: 0

As more heterogeneous chips and different types of circuitry are designed into one system, that all needs to be simulated, verified and validated before tape-out. Aveek Sarkar, vice president of engineering at Synopsys, talks with Semiconductor Engineering about the intersection of scale complexity and systemic complexity, the rising number of corners, and the reduced margin with which to buffe... » read more

Week In Review: Design, Low Power
By Jesse Allen - 16 Apr, 2021 - Comments: 0

Siemens Digital Industries Software will acquire OneSpin Solutions, a provider of formal verification tools. The company's portfolio of formal tools and apps covers a wide range of design verification, equivalence checking, and functional safety, as well as solutions for trust and security checking. Siemens plants to add OneSpin's technology to the Xcelerator portfolio of verification tools. ... » read more

Debug And Traceability Of MCMs And Chiplets In The Manufacturing Test Process
By Guy Cortez - 16 Apr, 2021 - Comments: 0

Single die packages and products have been the norm for decades. Moreover, so has multi-chip modules (MCMs) or system in package (SiP) for quite some time. Understandably, with ASICs and SoCs becoming larger while silicon geometries continue to get smaller, there is an opportunity to combine even more functionality into a smaller form factor for the end product. Hence, new advancements in desig... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Blog Review: April 14
By Jesse Allen - 14 Apr, 2021 - Comments: 0

Siemens EDA's Jake Wiltgen provides an overview of setting up an executing a fault injection campaign to prove that the IC or IP will safely operate under a faulted state caused by a random hardware failure, required to meet higher ASIL targets for ISO 26262 functional safety certification. Synopsys' Taylor Armerding considers the state of medical device security and the growing attack surfa... » read more

Requirements For Exhaustive SoC Reset Domain Crossing Checks
By Joe Mallett - 13 Apr, 2021 - Comments: 0

It is common to read that the numbers of clock domains and power domains in system-on-chip (SoC) designs are increasing, but for some reason there is less discussion about resets. There is no doubt that the number of reset domains is also rising; studies have shown that the single reset of twenty years ago has been replaced by a complex network of 40-50 domains in many chips and even 150 in som... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 09 Apr, 2021 - Comments: 0

Tools & IP Cadence debuted the Palladium Z2 Enterprise Emulation and Protium X2 Enterprise Prototyping systems. The Palladium Z2 is based on a new custom emulation processor, while the Protium X2 is based on Xilinx UltraScale+ VU19P FPGAs. Designed to work together with a common front-end flow, they provide 2X capacity and 1.5X performance improvements over the previous generations, and ne... » read more

Week In Review: Auto, Security, Pervasive Computing
By SE Staff - 09 Apr, 2021 - Comments: 0

Pervasive computing — IoT, edge, cloud, data center, and back LG Electronics says it is closing its mobile business unit to focus on growth areas such as electric vehicle components, connected devices, smart homes, robotics, artificial intelligence and business-to-business solutions, as well as platforms and services. The company will continue to update some premium phones after it leaves th... » read more

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