Privacy Protection A Must For Driver Monitoring


Driver monitoring systems are so tied into a vehicle's architecture that soon the driver will not be able to opt out because the vehicle will only operate if the driver is detected and monitored. This is raising privacy concerns about whether enough security is in place for the data to remain private. At the very least, laws and regulations in every geography where the vehicle will operate a... » read more

CISO’s Guide To Sensitive Data Protection


Emerging data protection and privacy laws are causing organizations to scramble to implement strategies that address regulatory compliance and data security governance. And the SolarWinds software supply chain attack, in which attackers inserted a malicious back door into its network software release that later led to sensitive data exposure, further underscores the need to secure the DevSecOps... » read more

Blog Review: March 31


Arm's Pavel Rudko considers several common approaches used to get better performance for neural network inference on mobile devices, such as optimizing and pruning the model and using different processing units to execute different workloads in parallel. Siemens EDA's Ray Salemi introduces basic concepts of using Python for verification and how to get Python to talk to an RTL device-under-te... » read more

Computing Where Data Resides


Computational storage is starting to gain traction as system architects come to grips with the rising performance, energy and latency impacts of moving large amounts of data between processors and hierarchical memory and storage. According to IDC, the global datasphere will grow from 45 zettabytes in 2019 to 175 by 2025. But that data is essentially useless unless it is analyzed or some amou... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive A fire at a Renesas fab may put a further squeeze on the supply of automotive chips, according to an Associated Press story. The fire in Naka Factory (located in Japan in Hitachinaka, Ibaraki Prefecture) was caused by plating equipment igniting within the first floor of the N3 Building and was extinguished the same day it started on March 19th, according to a press release. “The c... » read more

Week In Review: Design, Low Power


Companies Pearl Semiconductor launched to provide low and ultra-low noise timing products. “Pearl is a timing company developing resonator-agnostic solutions. We work with quartz crystals, MEMS resonators or whatever achieves superior performance,” said Ayman Ahmed, CEO of Pearl Semiconductor. “Current and future automotive applications demand low noise and a wide operating temperatur... » read more

Waiting For Chiplet Standards


The need and desire for chiplets is increasing, but for most companies that shift will happen slowly until proven standards are in place. Interoperability and compatibility depend on many layers and segments of the supply chain coming to agreement. Unfortunately, fragmented industry requirements may lead to a plethora of solutions. Standards always have enabled increasing specialization. ... » read more

Find Bugs Early: On-The-Fly Code Correction For Design And Verification Productivity


The key rule for chip design and verification is that bugs must be found and fixed as early in the development process as possible. It is often said that catching a bug at each successive project stage multiplies the cost by ten. Bugs that escape verification and make their way to silicon are very expensive and time-consuming to fix. The ideal is to catch as many types of issues as possible as ... » read more

Demand for IC Resilience Drives Methodology Changes


Applications that demand safety, security, and resilience are driving new ways of thinking about design, verification, and the long-term reliability of chips on a mass scale. The need is growing for chips that can process more data faster, over longer periods of time, and often within a shrinking power budget. That, in turn, is forcing changes at multiple levels, at the architecture, design,... » read more

What Goes Wrong In Advanced Packages


Advanced packaging may be the best way forward for massive improvements in performance, lower power, and different form factors, but it adds a whole new set of issues that were much better understood when Moore's Law and the ITRS roadmap created a semi-standardized path forward for the chip industry. Different advanced packaging options — system-in-package, fan-outs, 2.5D, 3D-IC — have a... » read more

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