Week in Review – IoT, Security, Auto


Products/Services Synopsys announced successful deployment of the Synopsys Yield Explorer yield learning platform for fast ramp-up of new products on Samsung's advanced finFET technology nodes. Using the secure data exchange mechanism in Yield Explorer, Samsung is able to share the data required for yield analysis, such as chip design, fab, and test, with its customers while maintaining the co... » read more

Week In Review: Design, Low Power


Si2's Unified Power Model has been approved as IEEE 2416-2019, a new Standard for Power Modeling to Enable System Level Analysis, which complements UPF/IEEE 1801-2018. UPM/IEEE 2416-2019 provides a set of power modeling semantics enabling system designers to model entire systems with flexibility. It supports power modeling from abstract design description to gate level implementation, providing... » read more

Blog Review: July 3


Cadence's Paul McLellan digs into 5G with a two-part post explaining the basics of the technology, what makes it so different from 4G, and the challenges ahead including the limitations of mmWave. Synopsys' Vikramjeet Bamel and Pankaj Sharma note the features that make GDDR6 a dominant memory in the high performance segment and allowing it to expand beyond graphics to automotive, AI, and AR/... » read more

Security’s Very Strange Path To Success


Security at the chip level appears to be heading toward a more promising future. The reason is simple—more people are willing to pay for security than in the past. For the most part, security is like insurance. You don't know it's working until something goes wrong, and you don't necessarily even know right away if there has been a breach. Sometimes it takes years to show up, because it ca... » read more

Edge Complexity To Grow For 5G


Edge computing is becoming as critical to the success of 5G as millimeter-wave technology will be to the success of the edge. In fact, it increasingly looks as if neither will succeed without the other. 5G networks won’t be able to meet 3GPP’s 4-millisecond-latency rule without some layer to deliver the data, run the applications and broker the complexities of multi-tier Internet apps ac... » read more

How To Automate Functional Safety


Semiconductor Engineering sat down to discuss functional safety thinking, techniques and approaches to automation with Mike Stellfox, Fellow at Cadence; Bryan Ramirez, strategic marketing manager at Mentor, a Siemens Business; Jörg Grosse, product manager for functional safety at OneSpin Solutions; and Marc Serughetti, senior director of product marketing for automotive verification solutions ... » read more

How To Navigate The Open Source Risk Landscape


Open source use isn’t risky, but unmanaged use of open source is. Open source software forms the backbone of nearly every application in every industry. Chances are that includes the applications your company develops as well. If you can’t produce an accurate inventory of the licenses, versions, and patch status of the open source components in your applications, it’s time to assess yo... » read more

Week In Review: Design, Low Power


VESA published the DisplayPort 2.0 standard, which allows for a max payload of 77.37 Gbps, a 3X increase in data bandwidth performance compared to DisplayPort 1.4a. The latest release also includes capabilities to address beyond 8K resolutions, higher refresh rates and HDR support at higher resolutions, multiple display configurations, and support for 4K-and-beyond VR resolutions. It is backwar... » read more

Week in Review: IoT, Security, Auto


Products/Services Visa agreed to acquire the token and electronic ticketing business of Rambus for $75 million in cash. The business involved is part of the Smart Card Software subsidiary of Rambus. It includes the former Bell ID mobile-payment businesses and the Ecebs smart-ticketing systems for transit providers. Meanwhile, Rambus expanded its CryptoManager Root of Trust product line. “Sec... » read more

Automation And Correct By Construction Will Empower 3D-IC Adoption


When research on 3D ICs was in full swing around 2009, I had been researching on how through-silicon-via (TSV) was related to thermal in a semiconductor chip-making company, and it seemed logical that 3D ICs would become mainstream. However, during the past 10 years, use of 3D stacked die has been applied to only a few applications, such as memory or image sensors, and the 2.5D solution using i... » read more

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