tag: Synopsys

Blog Review: Jan. 24
By Jesse Allen - 24 Jan, 2024 - Comments: 0

Siemens' John McMillan finds that while 3D-IC capabilities are ready for mainstream, mass adoption success depends on how easily, effectively, and efficiently a solution can be delivered and points to five workflow adoption focus areas. Cadence's Andre Baguenie shows how to easily convert a logic signal to an electrical value using Verilog-AMS and the transition filter. Synopsys' Chris Cl... » read more

Building A Comprehensive Multicloud Security Strategy: A Zero-Trust Approach
By Synopsys - 24 Jan, 2024 - Comments: 0

The traditional, perimeter-based security model is no longer sufficient in today’s dynamic, multicloud deployments. A zero-trust (ZT) security model, in which no user or system is inherently trusted, is becoming essential—it is a foundational capability that underpins security for multicloud strategies. The ZT security model operates on the principle of “Never trust. Always verify.” ... » read more

Using TCAD To Simulate Wide-Bandgap Materials For Electronics Design
By Shela Aboud - 22 Jan, 2024 - Comments: 0

Wide-bandgap (WBG) semiconductors are a class of materials that can offer a range of advantages over silicon. These materials can operate at higher voltages and higher temperatures, serving as critical enablers of innovation in Power and RF applications and functioning in a wider range of environments that are sometimes extreme. Electronics applications benefit from these wide-bandgap materials... » read more

Chip Industry Week In Review
By The SE Staff - 19 Jan, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Many More Hurdles In Heterogeneous Integration
By Laura Peters - 18 Jan, 2024 - Comments: 0

Advanced packaging options continue to stack up in the pursuit of “More than Moore” and higher levels of integration. It has become a place where many high-density interconnects converge, and where many new and familiar problems need to be addressed. The industry’s first foray into fine-pitch multi-die packaging utilized silicon interposers with through-silicon vias (TSVs) to deliver s... » read more

Navigating Heat In Advanced Packaging
By Gregory Haley - 18 Jan, 2024 - Comments: 0

The integration of multiple heterogeneous dies in a package is pivotal for extending Moore’s Law and enhancing performance, power efficiency, and functionality, but it also is raising significant issues over how to manage the thermal load. Advanced packaging provides a way to pack more features and functions into a device, increasingly by stacking various components vertically rather than ... » read more

Blog Review: Jan. 17
By Jesse Allen - 17 Jan, 2024 - Comments: 0

Cadence's Rajneesh Chauhan introduces the Back-Invalidate feature in Compute Express Link (CXL) 3.0 and how it contributes to the efficient functioning of modern data center architectures by upholding cache coherence across multiple hosts and devices. Synopsys' Brett Murdock and Dana Neustadter point out the importance of protecting against DRAM attacks such as Rowhammer, RAMbleed, and cold-... » read more

Which Data Works Best For Voltage Droop Simulation
By Ann Mutschler - 15 Jan, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the need for the right type of data, why this has to be done early in the design flow, and how 3D-IC will affect all of this, with Bill Mullen, distinguished engineer at Ansys; Rajat Chaudhry, product management group director at Cadence; Heidi Barnes, senior applications engineer at Keysight; Venkatesh Santhanagopalan, prod... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jan, 2024 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan Renesas will acquire Transphorm, which designs and manufactures gallium nitride power devices, for about $339 million. GaN, which is a wide-bandgap technology, is used for high-voltage applications in a slew of markets, including EVs and EV fast chargers, as well as data centers and industrial applications. Cadence acquired Invecas, a provider o... » read more

Glitch Power Issues Grow At Advanced Nodes
By Ann Mutschler - 11 Jan, 2024 - Comments: 0

An estimated 20% to 40% of total power is being wasted due to glitch in some of the most advanced and complex chip designs, and at this point there is no single best approach for how and when to address it, and mixed information about how effective those solutions can be. Glitch power is not a new phenomenon. DSP architects and design engineers are well-versed in the power wasted by long, sl... » read more

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