tag: Synopsys

Deploying Cutting-Edge Adaptive Test Analytics Apps
By Ken Butler - 12 Dec, 2023 - Comments: 0

By Ken Butler, Advantest, and Guy Cortez, Synopsys Semiconductor test challenges abound in this era of AI. As such, semiconductor test engineering is increasingly moving towards fully adaptive test where each device receives the “right” test content to assess its correctness. Advantest and Synopsys have partnered to provide new cutting-edge real-time adaptive test applications at the te... » read more

Leveraging IBIS-AMI Models To Optimize PCIe 6.0 Designs
By Synopsys - 12 Dec, 2023 - Comments: 0

The exploding demand for more data driven by advancements such as artificial intelligence and machine learning has created an increase in bandwidth (BW) for interconnects for different systems and hardware components such as graphic cards, network cards, storge devices, CPUs, memories, and many more. PCIe is the leading high-speed serial communication protocol for connecting such hardware compo... » read more

Chip Industry Week In Review
By The SE Staff - 08 Dec, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan AMD took the covers off new AI accelerators for training and inferencing of large language model and high-performance computing workloads. In its announcement, AMD focused heavily on performance leadership in the commercial AI processor space through a combination of architectural changes, better software efficiency, along with some improvements in... » read more

Security Becoming Core Part Of Chip Design — Finally
By Ann Mutschler - 07 Dec, 2023 - Comments: 1

Security is shifting both left and right in the design flow as chipmakers wrestle with how to build devices that are both secure by design and resilient enough to remain secure throughout their lifetimes. As increasingly complex devices are connected to the internet and to each other, IP vendors, chipmakers, and systems companies are racing to address existing and potential threats across a ... » read more

Why Are Automotive SoC Designers Turning To PCI Express 6.0?
By Richard Solomon - 07 Dec, 2023 - Comments: 0

Just over two decades ago, the introduction of PCI Express 1.0 marked the industry’s transition from then-ubiquitous parallel to serial interfaces. Back in 2002, the potential of “PCIe” in automotive applications was unforeseen – given the then-current state of in-vehicle computation and PCIe’s primary focus on desktop and data center use. Today, however, with the advent of connected ... » read more

AI Races To The Edge
By Karen Heyman - 07 Dec, 2023 - Comments: 0

AI is becoming increasingly sophisticated and pervasive at the edge, pushing into new application areas and even taking on some of the algorithm training that has been done almost exclusively in large data centers using massive sets of data. There are several key changes behind this shift. The first involves new chip architectures that are focused on processing, moving, and storing data more... » read more

Blog Review: Dec. 6
By Jesse Allen - 06 Dec, 2023 - Comments: 0

Cadence's Vinod Khera checks out potential implications of generative AI for EDA, including how it could increase the learning rate of students and reduce the rising verification cost. Synopsys' Kiran Vittal considers the driving factors behind RISC-V's growth and why it is becoming increasingly important for applications ranging from automotive to 5G mobile, AI, and data centers. Siemens... » read more

AI Accelerator Architectures Poised For Big Changes
By Ann Mutschler - 04 Dec, 2023 - Comments: 5

AI is driving a frenzy of activity in the chip world as companies across the semiconductor ecosystem race to include AI in their product lineup. The challenge now is how to make AI run faster, use less energy, and to be able to leverage it from the edge to the data center — particularly with the rollout of large language models. On the hardware side, there are two main approaches for accel... » read more

Chip Industry Week In Review
By The SE Staff - 01 Dec, 2023 - Comments: 0

By Susan Rambo, Gregory Haley, and Liz Allan Amkor plans to invest about $2 billion in a new advanced packaging and test facility in Peoria, Arizona. When finished, it will employ about 2,000 people and will be the largest outsourced advanced packaging facility in the U.S. The first phase of the construction is expected to be completed and operational within two to three years. Synopsys p... » read more

EDA Pushes Deeper Into AI
By Karen Heyman - 30 Nov, 2023 - Comments: 0

EDA vendors are ramping up the use of AI/ML in their tools to help chipmakers and systems companies differentiate their products. In some cases, that means using AI to design AI chips, where the number and breadth of features and potential problems is exploding. What remains to be seen is how well these AI-designed chips behave over time, and where exactly AI benefits design teams. And all o... » read more

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