Asia Government Funding Surges

By Liz Allan - 18 Nov, 2024 - Comments: 0

Billions of dollars have been pouring into Asian countries for the past few years in an effort to boost their production capacity, explore leading-edge technology, compete on the global stage, and shore up supply chains in the face of geopolitical turmoil. Each country has its own plan to maintain a foothold in the global market, from China’s Big Fund to Korea’s Yongin Cluster and Japan�... » read more

Chip Industry Week In Review

By The SE Staff - 15 Nov, 2024 - Comments: 0

CSIS issued a new report that says Intel is "not too big to fail, but too good to lose." The report noted that Intel is needed for national security, and that it must be viewed in a geopolitical context rather than from a purely business standpoint when it comes to funding the company. Japan's government is creating a 10 trillion yen (~$65 billion) fund for next-gen technologies, including A... » read more

Managing The Huge Power Demands Of AI Everywhere

By Ann Mutschler - 14 Nov, 2024 - Comments: 1

Before generative AI burst onto the scene, no one predicted how much energy would be needed to power AI systems. Those numbers are just starting to come into focus, and so is the urgency about how to sustain it all. AI power demand is expected to surge 550% by 2026, from 8 TWh in 2024 to 52 TWh, before rising another 1,150% to 652 TWh by 2030. Commensurately, U.S. power grid planners have do... » read more

Shift Left Is The Tip Of The Iceberg

By Brian Bailey - 14 Nov, 2024 - Comments: 1

Shift left is evolving from a buzzword into a much broader shift in design methodology and EDA tooling, and while it's still early innings there is widespread agreement that it will be transformative. The semiconductor industry has gone through many changes over the past few decades. Some are obvious, but others happen because of a convergence of multiple factors that require systemic change... » read more

New AI Data Types Emerge

By Bryon Moyer - 14 Nov, 2024 - Comments: 0

AI is all about data, and the representation of the data matters strongly. But after focusing primarily on 8-bit integers and 32‑bit floating-point numbers, the industry is now looking at new formats. There is no single best type for every situation, because the choice depends on the type of AI model, whether accuracy, performance, or power is prioritized, and where the computing happens, ... » read more

RISC-V’s Software Portability Challenge

By Brian Bailey - 13 Nov, 2024 - Comments: 0

Experts At The Table: RISC-V provides a platform for customization, but verifying those changes remains challenging. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeister, executive director for strategi... » read more

Innovate Faster with A Multi-Die Solution

By Synopsys - 13 Nov, 2024 - Comments: 0

The semiconductor industry is experiencing a monumental shift in chip design, driven by the dramatic increase in AI compute performance requirements and limitations of Moore’s Law. The industry is adopting multi-die designs, which is the heterogeneous or homogeneous integration of dies (also called chiplets) in a single package. While multi-die design is the solution, it also introduces se... » read more

Power-Aware Test Vector Porting For Production ATE

By Hari Mani - 12 Nov, 2024 - Comments: 0

Power management in contemporary system-on-chip (SoC) designs is almost unimaginably complex. Processors and other chip cores turn on and off as needed. Advanced features such as dynamic voltage and frequency scaling (DVFS) can adjust to changing conditions and incrementally adjust power and performance on the fly. Power management starts from the lowest hardware level of transistor structures ... » read more

Yield Management Embraces Expanding Role

By Laura Peters - 12 Nov, 2024 - Comments: 0

Competitive pressures, shrinking time-to-market windows, and increased customization are collectively changing the dynamics and demands for yield management systems, shifting left from the fab to the design flow and right to assembly, packaging, and in-field analysis. The basic role of yield management systems is still expediting new product introductions, reducing scrap, and delivering grea... » read more

Automotive OEMs Focus On SDVs, Zonal Architectures

By Ann Mutschler - 07 Nov, 2024 - Comments: 0

Giant automotive OEMs are re-evaluating how quickly to move to advanced technologies and software-driven designs amid crushing financial pressure from low-cost EVs developed in other markets such as China. U.S., European, and Japanese OEMs have been struggling for the past half-decade or so to figure out which is the best approach to developing EVs, undergoing multiple shifts in both hardwar... » read more

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Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

tag: Synopsys

Asia Government Funding Surges

Chip Industry Week In Review

Managing The Huge Power Demands Of AI Everywhere

Shift Left Is The Tip Of The Iceberg

New AI Data Types Emerge

RISC-V’s Software Portability Challenge

Innovate Faster with A Multi-Die Solution

Power-Aware Test Vector Porting For Production ATE

Yield Management Embraces Expanding Role

Automotive OEMs Focus On SDVs, Zonal Architectures

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