tag: Synopsys

Can Chiplets Serve Cost-Conscious Apps?
By Bryon Moyer - 17 Apr, 2025 - Comments: 0

Chiplets are emerging as a significant new phase in the evolution of the semiconductor market, providing a way to continue scaling performance well beyond the size limitations of a reticle. But that improvement comes with a high price tag and a lot more complexity, which so far has limited adoption. One of the main reasons for the cost increase is the need for advanced packaging when employi... » read more

Backside Power Delivery Nears Production
By Laura Peters - 17 Apr, 2025 - Comments: 0

Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower voltage droop, and reduced power supply noise. And it is poised to deliver these benefits below the 2nm node, despite a substantial disruption in front-end processes from lithography pattern di... » read more

Packaging With Fewer People And Better Results
By Gregory Haley - 17 Apr, 2025 - Comments: 1

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of overall device performance. In today’s multi-die assemblies, the assembly and packaging lines are expected to maintain signal integrity at multi-gigahertz frequencies, manage heat in verticall... » read more

Advanced Atomistic Simulation Techniques For Atomic Layer Etching
By Synopsys - 17 Apr, 2025 - Comments: 0

Continuous downscaling of the critical dimensions in semiconductor devices is the cornerstone of technological revolution. As the technology nodes keep shrinking, innovations in fabrication technologies are needed to continue the trend. We have arrived at the age where atomic level precision in the fabrication of semiconductor devices is needed to keep improving PPA. Thus, advanced film fabrica... » read more

Blog Review: Apr. 16
By Jesse Allen - 16 Apr, 2025 - Comments: 0

Siemens’ Tova Levy finds that heterogeneous integration necessitates a shift to a system-level technology co-optimization approach where power, performance, area, cost, and reliability are considered across various components, including silicon, package, interposer, and PCB. Synopsys’ Greg Sorber listens in as Arm’s Rene Haas and Synopsys’ Sassine Ghazi discuss the opportunity for AI... » read more

AI Agents Need Goals
By Brian Bailey - 16 Apr, 2025 - Comments: 0

Experts At The Table: Definitions and goals matter when it comes to using AI effectively, and it has to be tightly reined in to be effective. Semiconductor Engineering sat down with a panel of experts to discuss these issues and others, including Johannes Stahl, senior director of product line management for the Systems Design Group at Synopsys; Michael Young, director of product marketing for ... » read more

Leveraging Foundation IP For Low-Power AI Processor Development
By Shruti Bagaria - 15 Apr, 2025 - Comments: 0

Artificial intelligence (AI) has become widespread in recent years, quickly establishing itself as a groundbreaking technology. AI operates on machine learning (ML) algorithms, which demand substantial computational power. Traditionally, designers have utilized graphics processing units (GPUs) to run these ML algorithms. Initially created for graphics rendering, GPUs have shown to be highly eff... » read more

Chiplet Tradeoffs And Limitations
By Ann Mutschler - 10 Apr, 2025 - Comments: 0

The semiconductor industry is buzzing with the benefits of chiplets, including faster time to market, better performance, and lower power, but finding the correct balance between customization and standardization is proving to be more difficult than initially thought. For a commercial chiplet marketplace to really take off, it requires a much deeper understanding of how chiplets behave indiv... » read more

3D-IC Ecosystem Starts To Take Form
By Brian Bailey - 10 Apr, 2025 - Comments: 0

The adoption of chiplets is inevitable, but exactly when a mass migration toward this design approach will begin is yet to be determined. Nevertheless, some of the biggest technological and business-related barriers are being addressed. And while a chiplet-based design remains beyond the economic reach of many companies today, that is starting to change. Early signs of an emerging ecosystem ... » read more

Chip Industry Week In Review
By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

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