tag: Synopsys

How to Create Efficient Bump and TSV Plans for Multi-Die Designs
By Synopsys - 18 Jun, 2026 - Comments: 0

In a multi-die design logical and physical interconnectivity between dies (or a die and interposer or other substrate) is achieved through microbumps or hybrid bonding pads between contacting dies. Today’s multi-die designs can have hundreds of thousands or millions of bumps, and this number will be increasing dramatically in the future, as hybrid bonding technology greatly reduces the pi... » read more

Making On-Chip Photonics Manufacturable
By Gregory Haley - 18 Jun, 2026 - Comments: 0

Key Takeaways: System-level energy and bandwidth pressures are pulling optics into the package faster than the manufacturing flow can mature. Photonics combines front-end fabrication, materials, thermal, cleanliness, and test into one problem that can’t be solved domain by domain. Test is moving upstream because discovering an optical failure after final assembly forfeits every goo... » read more

Signoff Of Synthesis-Optimized Registers
By Ed Sperling - 17 Jun, 2026 - Comments: 0

How do you know when you sign off on a complex chip design that everything is going to work? There are more variables, more elements that need to be verified, and more waivers that need to be generated. Suresh Barla, senior director of field applications at Synopsys, talks about how to ensure that RTL is fully optimized for PPA targets in large designs that can include hundreds of millions of g... » read more

Designing Chips That Can Explain Themselves
By Ann Mutschler - 17 Jun, 2026 - Comments: 1

Key Takeaways: On-die telemetry gives architects a path to replace worst-case design margin with measured silicon behavior, improving PPA without compromising resilience. As monitor density and control-loop speed increase, observability must be architected hierarchically across local hardware response, on-die processing, and fleet-level learning. The real payoff is architectural: str... » read more

Blog Review: June 17
By Jesse Allen - 17 Jun, 2026 - Comments: 0

Cadence's Rajan Jani explains NVMe's Controller Memory Buffer feature, which exposes on-controller memory directly to the host system to reduce latency, improve PCIe fabric efficiency, and increase performance in multi-switch topologies. Siemens' Linus Tauro shares how to run an SSN datapath at double the I/O data rate by implementing a BusFrequencyMultiplier and BusFrequencyDivider pair. ... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jun, 2026 - Comments: 0

Notable deals Cadence and Intel Foundry inked a multi-year agreement to advance design technology co-optimization and create PDKs for Intel Foundry's 14A process. Nvidia and SK hynix announced a multi-year partnership to co-develop memory technology for AI infrastructure and physical AI. Teradyne unveiled an integrated test cell solution with TEL that supports known-good device scree... » read more

Agentic AI Is Changing Data Center Architectures
By Ann Mutschler - 11 Jun, 2026 - Comments: 0

Key Takeaways: The rise of agentic AI is shifting data centers from GPU-centric number crunching to CPU-driven orchestration, where managing long-running reasoning loops and context is just as important as raw compute. Integrating CPUs, GPUs, and stacked memory into tightly coupled multi-die architectures with varying workloads makes it much harder to ensure they will be reliable and ef... » read more

Can AI Create Missing Models?
By Brian Bailey - 11 Jun, 2026 - Comments: 0

Key takeaways Models are an essential part of EDA flows, each capturing necessary detail while retaining good execution performance. Models have been expensive to create, maintain and verify, restricting their utilization, but AI may be able to significantly reduce their cost. A deeper question remains. Should AI be used to create models that help existing flows, or should AI be used... » read more

Re-Architecting Die-to-Die IO For AI
By Lakshmi Jain - 11 Jun, 2026 - Comments: 0

By Lakshmi Jain and Wei-Yu Ma As AI-driven workloads continue to push the boundaries of compute scale, power efficiency, and bandwidth density, conventional die-to-die interconnect technologies—such as SerDes-based links and wide parallel IO—are increasingly becoming limiting factors. These approaches struggle to meet the growing demands for higher bandwidth density and improved energy e... » read more

Foundation IP: Pushing the Boundaries of Energy-Efficient Chip Design
By Synopsys - 11 Jun, 2026 - Comments: 0

Access “Foundation IP: Pushing the Boundaries of Energy-Efficient Chip Design” to explore six articles that explain how to address SoC design challenges using advanced Foundation IP solutions. Learn how these approaches enable energy efficiency, high performance, and reliability across key applications such as mobile, IoT, AI, HPC, automotive, crypto, and networking. Why read this digest... » read more

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