Why Co-Packaged Optics Should be Viewed as an Architectural Commitment (UW-Madison, MIT et al.)


A new technical paper, "3D optoelectronics and co-packaged optics: when solving the wrong problems stalls deployment," by the University of Wisconsin, MIT, and Invictus Innovation EV Technology. Abstract "The rapid growth of AI and accelerator-driven workloads is forcing a fundamental rethinking of optical interconnect architectures in datacenters. Co-packaged optics and three-dimensional... » read more

Future-Proofing System Design


This whitepaper has explored how converging forces—AI-driven workloads, heterogeneous integration, and increasingly complex security requirements—are transforming design priorities. Adaptability, openness, and lifecycle management are no longer secondary considerations but core architectural imperatives. Standardization through initiatives such as UCIe and OCP fosters interoperability and s... » read more

LLM- Based Techniques To Support Behavior-Driven Development For HW Design (U. of Bremen, DFKI)


A new technical paper titled "LLM-based Behaviour Driven Development for Hardware Design" was published by researchers at University of Bremen/DFKI. Abstract "Test and verification are essential activities in hardware and system design, but their complexity grows significantly with increasing system sizes. While Behavior Driven Development (BDD) has proven effective in software engineerin... » read more

Introducing a Digital Engineering Methodology To Aid All Engineers


A systems engineer developing a novel system-on-a-chip (SoC) design. A CFD engineer studying the airflow over the wing of a new electric airplane design. A safety engineer reviewing the design of a new pacemaker to confirm that it is compliant with existing regulations and requirements. What do all these people have in common? One connecting thread is the ever-present need to efficiently col... » read more

AI Won’t Replace Subject Matter Experts


Experts at The Table: The emergence of LLMs and other forms of AI has sent ripples through a number of industries, raising fears that many jobs could be on the chopping block, to be replaced by automation. Whether that’s the case in semiconductors, where machine learning has become an integral part of the design process, remains to be seen. Semiconductor Engineering sat down with a panel of e... » read more

System State Challenges Widen


Knowing the state of a system is essential for many analysis and debug tasks, but it's becoming more difficult in heterogeneous systems that are crammed with an increasing array of features. There is a limit as to how many things engineers can keep track of, and the complexity of today's systems extends far beyond that. Hierarchy and abstraction are used to help focus on the important aspect... » read more

Making Heterogeneous Integration More Predictable


Experts at the Table: Semiconductor Engineering sat down to discuss problems and potential solutions in heterogeneous integration with Dick Otte, president and CEO of Promex Industries; Mike Kelly, vice president of chiplets/FCBGA integration at Amkor Technology; Shekhar Kapoor, senior director of product management at Synopsys; John Park, product management group director in Cadence's Custom I... » read more

Arm Total Compute: Engineering For Tomorrow’s Workloads


As consumers seek richer and more immersive experiences from their devices, the way compute systems are engineered must continually evolve to keep up. Arm Total Compute takes a solution-focused approach to system-on-chip design, moving beyond individual IP elements to design and optimize the system as a whole to enable more digital immersion experiences. Not only does this white paper dis... » read more

Dealing With Performance Bottlenecks In SoCs


A surge in the amount of data that SoCs need to process is bogging down performance, and while the processors themselves can handle that influx, memory and communication bandwidth are straining. The question now is what can be done about it. The gap between memory and CPU bandwidth — the so-called memory wall — is well documented and definitely not a new problem. But it has not gone away... » read more

Overcoming Signal, Power, And Thermal Challenges Implementing GDDR6 Interfaces


Graphics processing units (GPUs) and graphics double data rate (GDDR) memory interfaces are essential to graphics cards, game consoles, high-performance computing (HPC), and machine learning applications. These interfaces enable data transfer speeds of over 665GB per second today and will continue to support well over a terabyte per second (TBps) in next-generation GDDR interfaces. Signal integ... » read more

← Older posts