Why EV Battery Design Is So Difficult

By Ann Mutschler - 03 Oct, 2019 - Comments: 4

Automotive batteries always have been treated as plug-and-play parts of a vehicle, but that approach no longer works in electric vehicles. In fact, the battery is now a differentiating factor, and it is the heaviest and most expensive component. What used to be a relatively simple component has been replaced by a variety of sensors to measure complex static thermal and aging effects, as well... » read more

Determining Where Power Analysis Matters Most

By Ann Mutschler - 08 Aug, 2019 - Comments: 0

How much accuracy is required in every stage of power analysis is becoming a subject of debate, as engineering teams wrestle with a mix of new architectures, different use cases and increasing pressure to get designs out on time. The question isn't whether power is a critical factor in designs anymore. That is a given. It is now about the most efficient way to tackle those issues, as well as... » read more

Are Digital Twins Something For EDA To Pursue?

By Ann Mutschler - 07 Aug, 2019 - Comments: 0

‘Digital Twins’ are one of the new, fashionable key concepts for system developers, but do they fit with EDA? How many different types of engines do these twins run on – abstract simulation, signal-based RTL simulation, emulation, prototyping, actual silicon? What should the use models be called for digital twinning – like reproduction of bugs from silicon in emulation? Or optimizing th... » read more

Partitioning Drives Architectural Considerations

By Ann Mutschler - 19 Jul, 2019 - Comments: 0

Semiconductor Engineering sat down to discuss partitioning with Raymond Nijssen, vice president of system engineering at Achronix; Andy Ladd, CEO at Baum; Dave Kelf, chief marketing officer at Breker; Rod Metcalfe, product management group director in the Digital & Signoff Group at Cadence; Mark Olen, product marketing group manager at Mentor, a Siemens Business; Tom Anderson, technical mar... » read more

5G OTA Test Not Ready For Production

By Kevin Fogarty - 09 Jul, 2019 - Comments: 0

5G is poised to dominate the wireless world, but over-the-air (OTA) testing of 5G beamforming antennas is still not ready for volume production. Beamforming is a critical element in the millimeter wave version of 5G, because of the limitations of ultra-high-frequency signals. Unlike 4G and its predecessors, millimeter wave technology will not penetrate objects, so signals need to be directed... » read more

HW/SW Design At The Intelligent Edge

By Ann Mutschler - 08 Jul, 2019 - Comments: 0

Adding intelligence to the edge is a lot more difficult than it might first appear, because it requires an understanding of what gets processed where based on assumptions about what the edge actually will look like over time. What exactly falls under the heading of Intelligent Edge varies from one person to the next, but all agree it goes well beyond yesterday’s simple sensor-based IoT dev... » read more

How Far Can AI Go?

By Ed Sperling - 30 May, 2019 - Comments: 1

AI is everywhere. There are AI/ML chips, and AI is being used to design and manufacture chips. On the AI/ML chip side, large systems companies and startups are striving for orders of magnitude improvements in performance. To achieve that, design teams are adding in everything from CPUs, GPUs, TPUs, DSPs, as well as small FPGAs and eFPGAs. They also are using small memories that can be read i... » read more

Auto Reliability At The System Level

By Ed Sperling - 28 Mar, 2019 - Comments: 0

Carmakers and chipmakers are approaching autonomous vehicle design from very different perspectives, and while they both talk about safety and reliability as the end goals, they have widely divergent ideas about how to get there. All of this is just beginning to come into focus as carmakers vie for leadership in the autonomous vehicle space, and much of it appears to hinge on the definition ... » read more

New Design Approaches At 7/5nm

By Ed Sperling - 04 Mar, 2019 - Comments: 0

The race to build chips with a multitude of different processing elements and memories is making it more difficult to design, verify and test these devices, particularly when AI and leading-edge manufacturing processes are involved. There are two fundamental problems. First, there are much tighter tolerances for all of the components in those designs due to proximity effects. Second, as a re... » read more

Can AI, 5G Chips Be Verified?

By Ed Sperling - 31 Jan, 2019 - Comments: 0

AI and 5G bode well for the semiconductor industry. They will require many billions of new, semi-customized and highly complex chips from the edge all the way to the data center, and they will require massive amounts of engineering time and tooling. But these technologies also are raising lots of questions on the design and verification front about what else can be automated and how to do it. ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?