The Week In Review: Design

By Ed Sperling - 13 Jun, 2014 - Comments: 0

Tools Mentor Graphics uncorked a tool for IC, package and board optimization, assembly and visualization. Of particular note is a “virtual die model” capability, which can be used across multiple domains in the design process. Deals Rambus inked a patent licensing agreement with Qualcomm Global Trading, a subsidiary of Qualcomm, for memory, interface and security technologies. The secu... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 09 May, 2014 - Comments: 0

Samsung Electronics announced that its memory fabrication line in Xi’an China has begun full-scale manufacturing operations. The new facility will manufacture Samsung’s advanced NAND flash memory chips, dubbed 3D V-NAND. A recent chemical leak at Intel’s fab in Arizona was contained and two workers were taken to a hospital for observation, according to reports. Apparently, Intel was i... » read more

Where’s The Juice?

By Ed Sperling - 18 Oct, 2013 - Comments: 0

Driving to work in an electric car is cool. Finding an available plug these days is not. A year ago, before the surge (no pun intended) in electric vehicle popularity, it used to be relatively easy to find a parking spot and a plug at most high-tech companies. In fact, sometimes it was the only available spot. In recent months that’s changed. It’s getting harder and much more stressful. ... » read more

The Week In Review: Aug. 26

By Mark LaPedus - 26 Aug, 2013 - Comments: 0

By Mark LaPedus The evolving relationship between humans and machines is the key theme of Gartner’s most "hyped” technologies in 2013. Gartner has chosen to feature the relationship between humans and machines due to the increased hype around smart machines, cognitive computing and the Internet of Things. Gartner also released its updated chart of hyped technologies. SunEdison, formerly... » read more

Does My Phone Dream?

By Synopsys - 09 May, 2013 - Comments: 0

By Cary Chin Starting with my commentary on the Tesla Model S last month (poor standby time before software update), I was thinking about how common a problem standby power is these days. Nearly all of our recently introduced smartphones have had similar problems (iPhone 5, Nexus 4, Galaxy S4, Lumia 900) running on virtually all operating systems (iOS 6.x, Android 4.2.x, Windows Phone 8). All ... » read more

A Low-Power Riddle

By Synopsys - 11 Apr, 2013 - Comments: 0

By Cary Chin I’m thinking of a mobile electronic device, introduced in 2012, at the high end of its market segment, eventually to be named “Product of the Year” for 2012. But it wasn’t introduced without the usual flurry of energy-efficiency related problems, with initial complaints such as, “the product worked well, but the battery drained way too fast, even when it was turned off!�... » read more

Tesla: The Ultimate Low-Power Design

By Ed Sperling - 13 May, 2009 - Comments: 0

When your battery pack alone costs $30,000 and you get 200 miles per charge, you've got to be looking for ways to save power. The Tesla roadster is crammed with parts from many Silicon Valley companies, all designed to draw as little power as possible. But there's still much more work to be done. [youtube vid=qdGLvJzBUYI] » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer