tag: Texas Instruments

China Foundries Seek Niches
By Mark LaPedus - 15 Aug, 2013 - Comments: 0

By Mark LaPedus For decades, China has launched several initiatives to modernize its semiconductor industry with hopes of becoming the next IC powerhouse in Asia. In 2001, for example, China unveiled its so-called "Tenth Five-Year Plan," which called for the nation to build 25 new fabs from 2001 to 2005. At the time, the Chinese government hoped to start and fund a new crop of domestic fou... » read more

Power Shifts In Digital Chip Space
By Bhanu Kapoor - 08 Aug, 2013 - Comments: 0

By Bhanu Kapoor The power issue has been quite disrupting in the digital semiconductor space. The processor architecture shifted to parallel processing with the “power wall” stopping the frequency scaling that the industry had conveniently used in the last few decades. The power issue also is causing semiconductor process technology to change in ways other than simply scaling from one ... » read more

Foundries Eye 300mm Analog Fabs
By Mark LaPedus - 18 Jul, 2013 - Comments: 0

By Mark LaPedus In 2009, Texas Instruments changed the semiconductor landscape when it opened the industry’s first 300mm fab for analog chips. Until then, analog chip production was conducted in fabs at 200mm wafer sizes and below. With a 300mm fab, TI potentially could gain a die-size and cost advantage over its analog rivals. On paper, a 300mm wafer provides 2.5 times more chips than a... » read more

Cost vs. Value
By Ann Mutschler - 10 May, 2013 - Comments: 0

By Ann Steffora Mutschler The increasing amount of mixed-signal content being included in SoCs for automotive, networking and all manner of mobile devices is reinvigorating the mixed-signal industry. While this is great news for companies playing in anything related to mixed-signal technology, it also means increasing complexity for the engineering teams pulling all the pieces together. “... » read more

Dangerous Electricity
By Ann Mutschler - 11 Apr, 2013 - Comments: 0

Electricity to the modern age is as indispensible as air, but too much can be a bad thing for automotive and aerospace applications—especially when it is in the form of electrostatic discharge (ESD). As chips advance to 28nm, 20nm and 16nm, the design window for electrostatic discharge is shrinking for a number of reasons, explained Norman Chang is vice president and senior product strategis... » read more

What’s Before Stacked Die?
By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Advanced 2.5D/3D chip stacking has a number of challenges and is still a few years away from mass production. In fact, mass production may not occur until 2015 or 2016. But OEMs can ill afford to sit still and wait for 2.5D/3D technology to mature. So, until 2.5D/3D is ready for prime time, chipmakers and IC-packaging houses are under pressure to innovate and extend current ... » read more

Quantum Shifts
By Ed Sperling - 25 Oct, 2012 - Comments: 0

By Ed Sperling Intel, STMicroelectronics and some of the leading memory providers already are working on 10nm process technology, and advanced researchers in universities and industry-leading companies are looking at 7nm, 5nm and even beyond. Those who have glimpsed this technological future have similar observations. There is no single technology problem that has to be solved at these node... » read more

Being Different Is Bad
By Ed Sperling - 23 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler Today’s SoCs contain as much as 80% existing IP that either has been re-used from previous projects or obtained from a third party. Models are created of this hardware IP, as well as new portions of the design, in order to create a virtual prototype that allows the engineering team to see the complete system by running software and applications. While this a... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

Analog In The 300mm Era
By Adrienne Downey - 31 Jul, 2012 - Comments: 0

By Adrienne Downey Semico forecasts the 2012 analog market will grow 5.1% to $44.5 billion, up from $42.3 billion in 2011. This is higher than the 0.1% analog revenue growth experienced in 2011 but lower than the 12.6% growth expected in 2013. Growth is coming from automotive electronics, the energy industry, wireless communications, and healthcare diagnostic and monitoring devices. In a re... » read more

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