tag: Texas Instruments

Dangerous Electricity
By Ann Mutschler - 11 Apr, 2013 - Comments: 0

Electricity to the modern age is as indispensible as air, but too much can be a bad thing for automotive and aerospace applications—especially when it is in the form of electrostatic discharge (ESD). As chips advance to 28nm, 20nm and 16nm, the design window for electrostatic discharge is shrinking for a number of reasons, explained Norman Chang is vice president and senior product strategis... » read more

What’s Before Stacked Die?
By Mark LaPedus - 13 Dec, 2012 - Comments: 0

By Mark LaPedus Advanced 2.5D/3D chip stacking has a number of challenges and is still a few years away from mass production. In fact, mass production may not occur until 2015 or 2016. But OEMs can ill afford to sit still and wait for 2.5D/3D technology to mature. So, until 2.5D/3D is ready for prime time, chipmakers and IC-packaging houses are under pressure to innovate and extend current ... » read more

Quantum Shifts
By Ed Sperling - 25 Oct, 2012 - Comments: 0

By Ed Sperling Intel, STMicroelectronics and some of the leading memory providers already are working on 10nm process technology, and advanced researchers in universities and industry-leading companies are looking at 7nm, 5nm and even beyond. Those who have glimpsed this technological future have similar observations. There is no single technology problem that has to be solved at these node... » read more

Being Different Is Bad
By Ed Sperling - 23 Aug, 2012 - Comments: 0

By Ann Steffora Mutschler Today’s SoCs contain as much as 80% existing IP that either has been re-used from previous projects or obtained from a third party. Models are created of this hardware IP, as well as new portions of the design, in order to create a virtual prototype that allows the engineering team to see the complete system by running software and applications. While this a... » read more

What Comes After FinFETs?
By Ed Sperling - 16 Aug, 2012 - Comments: 0

By Mark LaPedus The semiconductor industry is currently making a major transition from conventional planar transistors to finFETs starting at 22nm. The question is what’s next? In the lab, IBM, Intel and others have demonstrated the ability to scale finFETs down to 5nm or so. If or when finFETs runs out of steam, there are no less than 18 different next-generation candidates that could o... » read more

Analog In The 300mm Era
By Adrienne Downey - 31 Jul, 2012 - Comments: 0

By Adrienne Downey Semico forecasts the 2012 analog market will grow 5.1% to $44.5 billion, up from $42.3 billion in 2011. This is higher than the 0.1% analog revenue growth experienced in 2011 but lower than the 12.6% growth expected in 2013. Growth is coming from automotive electronics, the energy industry, wireless communications, and healthcare diagnostic and monitoring devices. In a re... » read more

SoC Platforms Gain Steam
By Ed Sperling - 26 Jul, 2012 - Comments: 0

By Ed Sperling Platforms are attracting far more attention from makers of SoCs because they are pre-verified and can speed time to market, but the shift isn’t so simple. It will spark major changes in the way companies design and build chips, causing significant disruption across the entire SoC ecosystem. Platforms are nothing new in the processor and software world. Intel, IBM AMD, and N... » read more

28, 20nm Nodes Demand Advanced Power Management
By Ed Sperling - 12 Jul, 2012 - Comments: 0

By Ann Steffora Mutschler With the complexity of getting 28 and 20nm designs to reach desired yields with the desired power and performance on the shoulders of design teams, advanced power management techniques are a must. Sub-clock power gating, clock power gate structures, adaptive body bias and other techniques are making it possible. Sub-Clock Power Gating Far from a new techniqu... » read more

Experts At The Table: Improving The Efficiency Of Software
By Ed Sperling - 29 Jun, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Design sat down to talk about how to write better software with Jan Rabaey, Donald O. Pederson Distinguished Professor at the University of California at Berkeley; Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Emily Shriver, research scientist at Intel; Alan Gibbons, principal engineer at Synopsys; and Dav... » read more

Experts At The Table: Improving The Efficiency Of Software
By Ed Sperling - 22 Jun, 2012 - Comments: 0

By Ed Sperling Low-Power/High-Performance Design sat down to talk about how to write better software with Jan Rabaey, Donald O. Pederson Distinguished Professor at the University of California at Berkeley; Barry Pangrle, solutions architect for low-power design and verification at Mentor Graphics; Emily Shriver, research scientist at Intel; Alan Gibbons, principal engineer at Synopsys; and Dav... » read more

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