Chip Industry Week in Review

By The SE Staff - 23 May, 2025 - Comments: 0

China's Xiaomi debuted an in-house-designed 10-core mobile SoC built on a 3nm process. The company did not identify the foundry. It also announced plans to invest 50 billion yuan (~$7B) over the next decade to develop high-end smartphone chips, as part of a 200 billion yuan (~$28B) core technology investment over the next five years. Kearney and SEMI released a report assessing the state of ... » read more

RISC-V Heralds New Era Of Cooperation

By Brian Bailey - 30 May, 2024 - Comments: 0

RISC-V is paving the way for open source to become accepted within the hardware community, creating a level of industry collaboration never seen in the past, while revitalizing the connection between academia and industry. The big question is whether this arrangement is just a placeholder while the industry re-learns how to develop processors, or whether this processor architecture is someth... » read more

Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Technical Paper Roundup: Mar. 11

By Liz Allan - 11 Mar, 2024 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

K-Fault Resistant Partitioning To Assess Redundancy-Based HW Countermeasures To Fault Injections

By Technical Paper Link - 07 Mar, 2024 - Comments: 0

A technical paper titled “Fault-Resistant Partitioning of Secure CPUs for System Co-Verification against Faults” was published by researchers at Université Paris-Saclay, Graz University of Technology, lowRISC, University Grenoble Alpes, Thales, and Sorbonne University. Abstract: "To assess the robustness of CPU-based systems against fault injection attacks, it is necessary to analyze the... » read more

Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

Chip Industry Week In Review

By The SE Staff - 23 Feb, 2024 - Comments: 0

By Jesse Allen, Gregory Haley, and Liz Allan Intel officially launched Intel Foundry this week, claiming it's the "world's first systems foundry for the AI era." The foundry also showed off a more detailed technology roadmap down to expanded 14A process technology. Intel CEO Pat Gelsinger noted the foundry will be separate from the chipmaker, utilize third-party chiplets and IP, and leverage... » read more

Startup Funding: January 2024

By Jesse Allen - 07 Feb, 2024 - Comments: 0

Big rounds marked January, with three companies raising over $100 million. Quantum computing topped the list, with the company that resulted from the merger of Cambridge Quantum Computing and Honeywell's quantum division raking in the third-largest round for a quantum computing company ever. Another chart-topper was an advanced packaging company that began mass production in its first factor... » read more

A Design Flow For Critical Embedded Systems

By Arteris - 23 Aug, 2023 - Comments: 0

Learn how IP encapsulation/packaging and interoperability using IP-XACT enabled automation in a complex verification & validation flow for aeronautical systems. Includes usage of these capabilities integrated using Arteris SoC integration technology: HW/SW codesign RTL, SystemC TLM and PSL Instruction Set Simulators Click here to read more. » read more

Week In Review: Auto, Security, Pervasive Computing

By Liz Allan - 28 Jul, 2023 - Comments: 0

BMW, General Motors, Honda, Hyundai, Kia, Mercedes-Benz, and Stellantis will create an electric vehicle charging network, installing more than 30,000 high-powered DC charge points accessible to any cars that use Combined Charging System (CCS) or North American Charging Standard (NACS) connectors. Opening summer 2024, the network will leverage Plug & Charge technology and allow easy digital ... » read more

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tag: Thales

Chip Industry Week in Review

RISC-V Heralds New Era Of Cooperation

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Mar. 11

K-Fault Resistant Partitioning To Assess Redundancy-Based HW Countermeasures To Fault Injections

Chip Industry Week In Review

Chip Industry Week In Review

Startup Funding: January 2024

A Design Flow For Critical Embedded Systems

Week In Review: Auto, Security, Pervasive Computing

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