tag: thermal interface materials

Alumina Nanowires Improve Thermal Management in Advanced Packaging (Georgia Tech et al.)
By Technical Paper Link - 28 Apr, 2026 - Comments: 0

A new technical paper, "Epoxy Composites Reinforced with Long Al2O3 Nanowires for Enhanced Thermal Management in Advanced Semiconductor Packaging," was published by researchers at the Georgia Institute of Technology and National Cheng Kung University. Abstract "The rapid increase in heat flux in advanced 2.5D/3D semiconductor packaging places stringent demands on thermal interface materia... » read more

Redefining Backside Metallization: Low‑Temperature Solutions For HDFO And S‑SWIFT Designs
By Dambi Jo - 19 Feb, 2026 - Comments: 0

As chip performance and integration continue to advance, thermal dissipation control has become increasingly critical not only at the wafer fabrication level but also in the packaging industry. For artificial intelligence (AI) and high performance computing (HPC) applications, the industry is gradually shifting toward 2.5D integration. In response to the growing demand, High-Density Fan-Out (HD... » read more

Unlocking Next-Gen Thermal Management: Why Indium-Based Metal TIMs Are Game-Changers
By JinSeon Min - 18 Dec, 2025 - Comments: 0

As electronic devices become more powerful and compact, thermal management has become one of the most critical challenges in advanced electronic packaging. High-performance processors used in AI computing, data centers, and 5G/6G infrastructure generate significant heat, and failure to dissipate effectively can lead to reduced performance, reliability issues, and even catastrophic component fai... » read more

Reliability Risks Shift To The Materials Stack
By Gregory Haley - 18 Dec, 2025 - Comments: 0

The semiconductor industry’s push into 3D integration and large-format substrates has fundamentally changed the role of materials in packaging. What were once structural supports and electrical insulators have become critical performance limiters. Modern packages contain far more polymers, adhesives, advanced dielectrics, thermal materials, and composite laminates than previous generations... » read more

Mitigating Warpage In Multi-Chiplet Systems
By Laura Peters - 22 Sep, 2025 - Comments: 0

Warpage of dies, redistribution layers, and interposers is a growing problem in multi-chiplet packages, and it can have a dramatic impact on the behavior and reliability of these devices. Multiple factors contribute to warpage, including larger chip sizes, severe thinning of the silicon substrate, temporary bonding and debonding processes, and scaling of bump pitch and size. Each of these ca... » read more

Engineering Reliable Heat Dissipation With Indium-Silver Thermal Interfaces
By MinJae Kong - 24 Jul, 2025 - Comments: 0

In recent years, rapid technological advancements in the field of high-performance computing have driven the development of increasingly sophisticated and powerful computing devices. This growth is expected to continue, with expansion into areas such as central processing units (CPUs), artificial intelligence (AI) systems, and automotive products. Flip chip lidded ball grid array (FCLBGA) pa... » read more

Power Delivery Challenges For AI Chips
By Gregory Haley - 19 Jun, 2025 - Comments: 0

As artificial intelligence (AI) workloads grow larger and more complex, the various processing elements being developed to process all that data are demanding unprecedented levels of power. But delivering this power efficiently and reliably, without degrading signal integrity or introducing thermal bottlenecks, has created some of the toughest design and manufacturing challenges in semiconducto... » read more

Cooling Chips Still A Top Challenge
By Bryon Moyer - 22 May, 2025 - Comments: 0

Increasing levels of semiconductor integration means more work needs to be done in smaller spaces, which in turn generates more heat that needs to be dissipated. Managing heat dissipation in advanced node dies and in multi-die assemblies is critical to their functionality and their longevity. And while much of the focus has been on improving power efficiency, which reduces the rate of power ... » read more

Optimization Approach For The Dispensing of Thermal Interface Material (KIT, Robert Bosch)
By Technical Paper Link - 21 May, 2025 - Comments: 0

A new technical paper titled "TIMtrace: Coverage Path Planning for Thermal Interface Materials" was published by researchers at Karlsruhe Institute of Technology (KIT) and Robert Bosch GmbH. Abstract "Thermal Interface Materials are used to transfer heat from a semiconductor to a heatsink. They are applied along a dispense path onto the semiconductor and spread over its entire surface once ... » read more

How Die Dimensions Challenge Assembly Processes
By Anne Meixner - 19 Sep, 2024 - Comments: 1

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To fully enable a multi-chiplet ecosystem, standardized component handling and interfaces are needed. The underlying concept is similar to LEGO blocks that simply snap together, yet it's nowhere near t... » read more

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