New Data Format Boosts Test Analytics


Demand for more and better data for test is driving a major standards effort, paving the way for one of most significant changes in data formats in years. There is good reason for this shift. Data from device testing is becoming a critical element in test program decisions regarding limits and flows. This is true for everything from automotive and medical components to complex, heterogeneous... » read more

Challenges For A Post-Moore’s Law World


Semiconductor Engineering sat down to discuss challenges at the edge, the impact of open-source, and how to attract new talent, with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The con... » read more

Week In Review: Manufacturing, Test


Fast Arm-based supercomputer Japan has taken the lead in the supercomputer race, jumping ahead of the U.S. But China continues to make its presence felt in the arena. Fugaku, an ARM-based supercomputer jointly developed by Japan’s Riken and Fujitsu, is now ranked the world’s fastest supercomputer in the 55th TOP500 list. Fugaku turned in a high performance Linpack (HPL) result of 415.5... » read more

Week In Review: Manufacturing, Test


Fab tools and test KLA has announced the formation of a new business group for its Electronics, Packaging and Components (EPC) businesses. The new EPC group includes the ICOS, Orbotech and the SPTS Technologies organizations. The group will be headed by Oreste Donzella, KLA’s executive vice president. In 2018, KLA acquired Orbotech for $3.4 billion, a deal that included two organizations-... » read more

Manufacturing Bits: April 28


Gate-all-around reliability The 2020 IEEE International Reliability Physics Symposium (IRPS) will kick off this week, this time as a virtual event. IRPS is a conference that focuses on the latest research in microelectronics reliability. The event starts off with keynotes from Infineon, Intel and Texas Instruments. IRPS also involves a multitude of papers and presentations. On the logi... » read more

Falling Chip Forecasts


It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Week In Review: Manufacturing, Test


Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week In Review: Manufacturing, Test


Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

Week In Review: Manufacturing, Test


Trade More trade news: "The Trump administration is hiking duties on $200 billion worth of Chinese products to 25% from 10%," according to CNBC. The following is attributed to Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), in response to President Trump’s plan to increase tariffs on $200 billion worth of Chinese imports to 25%: “The president is seeking a bet... » read more

Moore’s Law Now Requires Advanced Packaging


Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

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