Falling Chip Forecasts


It’s time to take a pulse of the semiconductor market amid the memory downturn and trade frictions with China. For some time, the DRAM and NAND markets have been hit hard with falling prices and oversupply. Then, the Trump administration last year slapped tariffs on Chinese goods. China retaliated. And the trade war rages on between the U.S. and China. More recently, the U.S. Department... » read more

Week In Review: Manufacturing, Test


Packaging and test In the rankings, ASE was the top OSAT in terms of sales in the first quarter of 2019, according to TrendForce. Amkor and JCET were next in the rankings. “Judging from the falling phone sales 1Q19 impacted by the U.S.-China trade dispute and the oversupply situation in memory markets, the total revenue of the top ten businesses in packaging and testing are predicted to st... » read more

Week In Review: Manufacturing, Test


Market research In terms of overall IC sales, Intel has replaced Samsung as the number one quarterly semiconductor supplier in 4Q18 after losing the lead spot to Samsung in 2Q17, according to IC Insights. “While Samsung held the full-year number one ranking in 2017 and 2018, Intel is forecast to easily recapture the number one ranking for the full-year of 2019, a position it previously held ... » read more

Week In Review: Manufacturing, Test


Trade More trade news: "The Trump administration is hiking duties on $200 billion worth of Chinese products to 25% from 10%," according to CNBC. The following is attributed to Gary Shapiro, president and CEO of the Consumer Technology Association (CTA), in response to President Trump’s plan to increase tariffs on $200 billion worth of Chinese imports to 25%: “The president is seeking a bet... » read more

Moore’s Law Now Requires Advanced Packaging


Semiconductor Engineering sat down to discuss advanced packaging with Calvin Cheung, vice president of engineering at ASE; Walter Ng, vice president of business management at UMC; Ajay Lalwani, vice president of global manufacturing operations at eSilicon; Vic Kulkarni, vice president and chief strategist in the office of the CTO at ANSYS; and Tien Shiah, senior manager for memory at Samsung. W... » read more

Week In Review: Manufacturing, Test


Fab tools ASML said it has disagreed with any implication that it has been a victim of “Chinese espionage,” as stated in an article in a Dutch newspaper. The article discusses the results of a public court case in the United States that ASML won last year. In the case, XTAL was found by a jury to have misappropriated ASML’s confidential and proprietary information as well as trade secret... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Diamond semiconductor IP vendor AKHAN Semiconductor is cooperating with a U.S. federal investigation into alleged theft of its intellectual property by China’s Huawei. When AKHAN agreed to send its proprietary technology to Huawei pursuant to an agreement, AKHAN “believes that Huawei destroyed our product, shipped it to China without authorization, subjected it to tests... » read more

What Will Intel Do Next?


The writing is on the wall for big processor makers. Apple, Amazon, Facebook and Google are developing their own processors. In addition, there are more than 30 startups developing various types of AI accelerators, as well as a field of embedded FPGA vendors, a couple of discrete FPGA makers, and a slew of soft processor cores. This certainly hasn't been lost on Intel. As the world's largest... » read more

The Race To Zero Defects


By Jeff Dorsch and Ed Sperling Testing chips is becoming more difficult, more time-consuming, and much more critical—particularly as these chips end up in cars, industrial automation, and a variety of edge devices. Now the question is how to provide enough test coverage to ensure that chips will work as expected without slowing down the manufacturing process or driving up costs. Balanci... » read more

Week in Review: IoT, Security, Auto


Internet of Things Arm uncorked its first forward-looking CPU roadmap and performance numbers for client computing. The company said it expects to deliver annual performance improvements of more than 15% per year through 2020. The targeted market includes 5G, always-on, always-connected devices. C3 IoT will work with Google Cloud to support artificial intelligence and Internet of Things dep... » read more

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