tag: tin

New Class Of Semiconductors Made Of Germanium-Tin Alloy (University of Edinburgh et al.)
By Technical Paper Link - 16 Feb, 2026 - Comments: 0

A new technical paper "High Pressure and Compositionally Directed Route to a Hexagonal GeSn Alloy Class" was published by researchers at the University of Edinburgh, GFZ Helmholtz Centre for Geosciences, the University of Lille, Grenoble Alpes University, the University of Bayreuth and the European Synchrotron facility. Abstract "Despite their electronic dominance, cubic diamond structure... » read more

SiGeSn SBFETs at Cryogenic Temperatures (Tu Wien et al)
By Technical Paper Link - 07 Jan, 2026 - Comments: 0

A new technical paper titled "A Cryogenic Ultra-Thin Body SiGeSn Transistor" was published by researchers at TU Wien, Johannes Kepler University, Universidad de Granada, and Max Planck Institute for Sustainable Materials. Abstract "Transistors capable of operating at cryogenic temperatures are key components for the fast and energy-efficient control and readout of qubits. However, the ultra... » read more

How Different Metal Depositions Affect The Structure And Charge Transport Of 9-A Graphene Nanoribbons
By Technical Paper Link - 06 Dec, 2023 - Comments: 0

A technical paper titled “Contact engineering for graphene nanoribbon devices” was published by researchers at University of Arizona, Swiss Federal Labs for Materials Science and Technology, University of California Berkeley, Stanford University, SRM Institute of Science and Technology, Texas A&M University, Lawrence Berkeley National Laboratory (LBNL), Max Planck Institute for Polymer... » read more

Design of Selective Deposition Processes For Nanoscale Electronic Devices
By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “Quantified Uniformity and Selectivity of TiO2 Films in 45-nm Half Pitch Patterns Using Area-Selective Deposition Supercycles” was published by researchers at IMEC, North Carolina State University, and KU Leuven. Abstract: "Area-selective deposition (ASD) shows great promise for sub-10 nm manufacturing in nanoelectronics, but significant challenges remain in scali... » read more

Extending Copper Interconnects To 2nm
By Laura Peters - 17 Mar, 2022 - Comments: 0

Transistor scaling is reaching a tipping point at 3nm, where nanosheet FETs will likely replace finFETs to meet performance, power, area, and cost (PPAC) goals. A significant architectural change is similarly being evaluated for copper interconnects at 2nm, a move that would reconfigure the way power is delivered to transistors. This approach relies on so-called buried power rails (BPRs) and... » read more

System Bits: March 26
By Jeff Dorsch - 26 Mar, 2019 - Comments: 0

Swear to tell the truth Lots of lies are told on the Internet. Shuyuan Ho of Florida State University wants to unveil those falsehoods with an online polygraph. “The future of my research is an online polygraph that could be used many different ways,” said Ho, an associate professor in the College of Communication and Information. “You could use it for online dating, Facebook, Twitter... » read more

Trade War Looms Over Materials
By Mark LaPedus - 18 Aug, 2016 - Comments: 1

It’s time to pay close attention to rare earths and raw materials--again. In fact, the supply chain teams and commodity buyers at aerospace, automotive and electronics companies may have some new and potentially big problems on their hands. For some time, the European Union (EU), the United States and other nations have been at odds with China over rare earths. China, which accounts for... » read more

Extending The Hardmask
By Mark LaPedus - 19 May, 2015 - Comments: 0

In chip production, the backend-of-the-line (BEOL) is where the critical interconnects are formed within a device. Interconnects—those tiny wiring schemes in devices—are becoming more compact at each node. This, in turn, is causing a degradation in performance and an increase in the resistance-capacitance (RC) delay in chips. “The scaling roadblocks that the interconnect faces need to ... » read more

EU Due Diligence For Conflict Minerals Focuses Upstream, For Now
By SEMI - 17 Apr, 2014 - Comments: 0

By Rania Georgoutsakou EU proposed legislation on responsible sourcing of ‘conflict minerals’, published on 5 March 2014, will create a voluntary scheme focusing on upstream suppliers that should help downstream users get the information they need to comply with the U.S. Dodd Frank Act. The EU proposals largely address concerns raised by SEMI and other industry associations, but things cou... » read more

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