Challenges Of Edge AI Inference

By Vinay Mehta - 01 Jul, 2021 - Comments: 0

Bringing convolutional neural networks (CNNs) to your industry—whether it be medical imaging, robotics, or some other vision application entirely—has the potential to enable new functionalities and reduce the compute requirements for existing workloads. This is because a single CNN can replace more computationally expensive image processing, denoising, and object detection algorithms. Howev... » read more

Architectural Considerations For AI

By Brian Bailey - 24 Jun, 2021 - Comments: 2

Custom chips, labeled as artificial intelligence (AI) or machine learning (ML), are appearing on a weekly basis, each claiming to be 10X faster than existing devices or consume 1/10 the power. Whether that is enough to dethrone existing architectures, such as GPUs and FPGAs, or whether they will survive alongside those architectures isn't clear yet. The problem, or the opportunity, is that t... » read more

Applications, Challenges For Using AI In Fabs

By Mark LaPedus - 14 Apr, 2021 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss chip scaling, transistors, new architectures, and packaging with Jerry Chen, head of global business development for manufacturing & industrials at Nvidia; David Fried, vice president of computational products at Lam Research; Mark Shirey, vice president of marketing and applications at KLA; and Aki Fujimura, CEO of D2S. Wh... » read more

HBM2E Raises The Bar For AI/ML Training

By Frank Ferro - 11 Mar, 2021 - Comments: 0

The largest AI/ML neural network training models now exceed an enormous 100 billion parameters. With the rate of growth over the last decade on a 10X annual pace, we’re headed to trillion parameter models in the not-too-distant future. Given the tremendous value that can be derived from AI/ML (it is mission critical to five of six of the top market cap companies in the world), there has been ... » read more

Stretching Engineers

By Brian Bailey - 22 Dec, 2020 - Comments: 1

Engineering has one constant — you innovate or fall by the wayside. That is true both for the things that are designed and for the engineers who design and build them. Today’s systems are putting new strains on engineers who can no longer be "tall and thin" or "short and fat." Those descriptions pertain to an engineer who is either highly specialized or one who has much broader experience. ... » read more

Difficult Memory Choices In AI Systems

By Ann Mutschler - 12 Nov, 2020 - Comments: 0

The number of memory choices and architectures is exploding, driven by the rapid evolution in AI and machine learning chips being designed for a wide range of very different end markets and systems. Models for some of these systems can range in size from 10 billion to 100 billion parameters, and they can vary greatly from one chip or application to the next. Neural network training and infer... » read more

Big Changes In AI Design

By Ed Sperling And Susan Rambo - 06 Aug, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss AI and its move to the edge with Steven Woo, vice president of enterprise solutions technology and distinguished inventor at Rambus; Kris Ardis, executive director at Maxim Integrated; Steve Roddy, vice president of Arm's Products Learning Group; and Vinay Mehta, inference technical marketing manager at Flex Logix. What follows are excerpts of that ... » read more

Are Better Machine Training Approaches Ahead?

By Bryon Moyer - 01 Jul, 2020 - Comments: 1

We live in a time of unparalleled use of machine learning (ML), but it relies on one approach to training the models that are implemented in artificial neural networks (ANNs) — so named because they’re not neuromorphic. But other training approaches, some of which are more biomimetic than others, are being developed. The big question remains whether any of them will become commercially viab... » read more

ML Opening New Doors For FPGAs

By Bryon Moyer - 24 Jun, 2020 - Comments: 0

FPGAs have long been used in the early stages of any new digital technology, given their utility for prototyping and rapid evolution. But with machine learning, FPGAs are showing benefits beyond those of more conventional solutions. This opens up a hot new market for FPGAs, which traditionally have been hard to sustain in high-volume production due to pricing, and hard to use for battery-dri... » read more

The Murky World Of AI Benchmarks

By Ann Mutschler - 30 Apr, 2020 - Comments: 0

AI startup companies have been emerging at breakneck speed for the past few years, all the while touting TOPS benchmark data. But what does it really mean and does a TOPS number apply across every application? Answer: It depends on a variety of factors. Historically, every class of design has used some kind of standard benchmark for both product development and positioning. For example, SPEC... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?