Single Vs. Multi-Patterning EUV


Extreme ultraviolet (EUV) lithography finally is moving into production, but foundry customers now must decide whether to implement their designs using EUV-based single patterning at 7nm, or whether to wait and instead deploy EUV multiple patterning at 5nm. Each patterning scheme has unique challenges, making that decision more difficult than it might appear. Targeted for 7nm, single pattern... » read more

Inside FD-SOI And Scaling


Gary Patton, chief technology officer at [getentity id="22819" comment="GlobalFoundries"], sat down with Semiconductor Engineering to discuss FD-SOI, IC scaling, process technology and other topics. What follows are excerpts of that conversation. SE: In logic, GlobalFoundries is shipping 14nm finFETs with 7nm in the works. The company is also readying 22nm FD-SOI technology with 12nm FD-SOI ... » read more

Where Is Next-Gen Lithography?


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

Where Is Next-Gen Lithography?


Semiconductor Engineering sat down to discuss lithography and photomask technologies with Greg McIntyre, director of the Advanced Patterning Department at [getentity id="22217" comment="Imec"]; Harry Levinson, senior fellow and senior director of technology research at [getentity id="22819" comment="GlobalFoundries"]; Uday Mitra, vice president and head of strategy and marketing for the Etch Bu... » read more

Tech Talk: Double-Triple Patterning


Mentor Graphics' David Abercrombie shows the differences and challenges in double patterning versus triple patterning. [youtube vid= e0wZmjBbEf0] » read more

Resetting Expectations On Multi-Patterning Decomposition And Checking


As I said in Part 1 of this topic, it never ceases to amaze me how much confusion and misunderstanding there is when it comes to multi-patterning (MP) decomposition and checking. That entire first article only focused on the typical subjects I’ve had to discuss with customers regarding double-patterning (DP). I have to tell you that with the deployment of triple-patterning (TP) and quadruple-... » read more

Resetting Expectations On Multi-Patterning Decomposition And Checking


It never ceases to amaze me how much confusion and misunderstanding there is when it comes to multi-patterning (MP) decomposition and checking. I sometimes forget just how new a topic it is in our industry. Because of this short-lived history, and the limited time designers have had to acquire any detailed understanding of its complexity, there appears to be some serious disconnect in expectati... » read more

EUV: Cost Killer Or Savior?


Moore’s Law, the economic foundation of the semiconductor industry, states that transistor density doubles in each technology generation, at constant cost. As IMEC’s Arindam Mallik explained, however, the transition to a new technology node is not a single event, but a process. Typically, when the new technology is first introduced, it brings a 20% to 25% wafer cost increase. Process opt... » read more

Tech Talk: 10nm Patterning


David Abercrombie, advanced physical verification methodology program manager at Mentor Graphics, talks about triple and quadruple patterning after 20/16/14nm and what design teams need to understand to get this right. [youtube vid=7bjutPWakpw] » read more

Multiple Lithography Options Still Remain in Play


The throughput and uptime of EUV, and the overlay accuracy of 193nm immersion lithography, continue to steadily improve, though neither is yet ready for 10nm production, according to speakers at SEMICON West. Mike Lercel, ASML director, Product Marketing, reported several EUV tool sites achieved 70 percent uptime for more than a week, and one customer site had done so for more than four ... » read more

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