Chip Industry Week In Review

By The SE Staff - 11 Apr, 2025 - Comments: 0

Don't have time to read this? Check out Semiconductor Engineering's Inside Chips podcast. The U.S. Department of Commerce is investigating TSMC for potential export control violations involving Huawei chips, reports Reuters. The probe follows TechInsights' teardown of a Huawei AI accelerator chip last year. The foundry, meanwhile, maintains it has not shipped any chips to Huawei since 2020... » read more

2030 Data Center AI Chip Winners: The Trillion Dollar Club

By Geoff Tate - 07 Apr, 2025 - Comments: 0

At the start of 2025, I believed AI was overhyped, ASICs were a niche, and a market pullback was inevitable. My long-term view has changed dramatically. AI technology and adoption is accelerating at an astonishing pace. One of the GenAI/LLM leaders, or Nvidia, will be the first $10 Trillion market cap company by 2030. Large language models (LLMs) are rapidly improving in both capability and ... » read more

Chip Industry Week In Review

By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Chip Industry Week In Review

By The SE Staff - 21 Mar, 2025 - Comments: 0

Semiconductor industry energy consumption grew 125% between 2015 and 2023, while direct greenhouse gas emissions rose 23% in the same period, according to the Europe think tank Interface, which analyzed corporate social responsibility reports from 28 global chip manufacturers. CSIS' new report "Understanding U.S. Allies’ Current Legal Authority to Implement AI and Semiconductor Export Cont... » read more

Chip Industry Week In Review

By The SE Staff - 14 Mar, 2025 - Comments: 0

ASML and imec signed a five-year strategic partnership to advance semiconductor innovation and sustainable technology. The collaboration will leverage ASML’s full product portfolio, including high-NA EUV, DUV immersion, and advanced metrology tools, within imec’s pilot line for sub-2nm R&D. Supported by EU and national funding, it will also drive research in silicon photonics, memory, a... » read more

Chip Industry Week In Review

By The SE Staff - 07 Mar, 2025 - Comments: 0

The Malaysian government signed a deal with Arm to kickstart a chip design ecosystem. Until now, Malaysia has focused on packaging and test. Adding chip design represents a major change in focus. The country will pay SoftBank $250 million over 10 years for Arm’s chip design IP and train 10,000 engineers. Global chip sales reached $56 billion in January, up nearly 18% from the same period i... » read more

Chip Industry Week In Review

By The SE Staff - 28 Feb, 2025 - Comments: 0

Intel said its new fab in Licking County, Ohio will be delayed due to financial struggles and a need to align chip production with market demand, reported the Columbus Dispatch. Construction is now estimated to be completed in 2030, with operations to start in 2030 or 2031. The company said it already has invested $3.7 billion locally. Apple plans to invest more than $500 billion in the U.S... » read more

Chip Industry Technical Paper Roundup: Feb. 25

By Liz Allan - 25 Feb, 2025 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=408 /] Find all technical papers here. » read more

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)

By Technical Paper Link - 24 Feb, 2025 - Comments: 0

A new technical paper titled "Assessing Design Space for the Device-Circuit Codesign of Nonvolatile Memory-Based Compute-in-Memory Accelerators" was published by TSMC researchers. Abstract "Unprecedented penetration of artificial intelligence (AI) algorithms has brought about rapid innovations in electronic hardware, including new memory devices. Nonvolatile memory (NVM) devices offer one s... » read more

Interconnects Approach Tipping Point

By Laura Peters - 20 Feb, 2025 - Comments: 0

As leading devices move to next generation nanosheets for logic, their interconnections are getting squeezed past the point where they can deliver low resistance pathways. The 1nm (10Å) node will have 20nm pitch and larger metal lines, but the interconnect stack already consumes a third of device power and accounts for 75% of the chip's RC delay. Changing this dynamic requires a superior co... » read more

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tag: TSMC

Chip Industry Week In Review

2030 Data Center AI Chip Winners: The Trillion Dollar Club

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Technical Paper Roundup: Feb. 25

Design Space For The Device-Circuit Codesign Of NVM-Based CIM Accelerators (TSMC)

Interconnects Approach Tipping Point

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