tag: TSMC

Week In Review: Design, Low Power
By Jesse Allen - 23 Apr, 2021 - Comments: 0

Skyworks Solutions will acquire Silicon Labs' Infrastructure & Automotive (I&A) business for $2.75 billion cash. The transaction includes Silicon Labs' power/isolation, timing and broadcast products, intellectual property, and approximately 350 employees. Silicon Labs said it will focus on its IoT business, which includes integrated hardware and software wireless platforms for multiple ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 23 Apr, 2021 - Comments: 0

Automotive & transportation Chip shortages continue to affect automotive production lines and the bottom line of automotive OEMs. Jaguar Land Rover and Daimler this week said they will reduce production because chip supply issues. Other car companies have or are planning to temporarily shut down production lines. Renault, GM, Ford, Fiat Chrysler (now Stellantis), Volkswagen, Nissan, and Ho... » read more

Foundry Wars Begin
By Mark LaPedus - 19 Apr, 2021 - Comments: 3

Leading-edge foundry vendors are gearing up for a new, high-stakes spending and technology race, setting the stage for a possible shakeup across the semiconductor manufacturing landscape. In March, Intel re-entered the foundry business, positioning itself against Samsung and TSMC at the leading edge, and against a multitude of foundries working at older nodes. Intel announced plans to build ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Apr, 2021 - Comments: 0

Chipmakers TSMC has posted strong results and raised its capital spending budget to $30 billion, up from its prior guidance of $25 billion to $28 billion in 2021. “Its outlook indicates broad-based semiconductor demand continues to strengthen amid supply chain tightness,” said Weston Twigg, an analyst at KeyBanc, in a research note. “TSMC posted another quarter of strong demand for leadi... » read more

The Quest For Curvilinear Photomasks
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

The semiconductor industry is making noticeable progress on the development of advanced curvilinear photomasks, a technology that has broad implications for chip designs at the most advanced nodes and the ability to manufacture those chips faster and cheaper. The question now is when will this technology move beyond its niche-oriented status and ramp up into high-volume manufacturing. For ye... » read more

Latest IC Forecast: Big Demand, Shortages
By Mark LaPedus - 15 Apr, 2021 - Comments: 1

Over the last year, the semiconductor industry has seen its share of highs, lows and uncertainties. In early 2020, the business looked bright, but the IC market dropped amid the Covid-19 pandemic outbreak. Throughout 2020 different countries implemented a number of measures to mitigate the outbreak, such as stay-at-home orders and business closures. Economic turmoil and job losses soon follo... » read more

Making Chip Packaging More Reliable
By Mark LaPedus - 15 Apr, 2021 - Comments: 0

Packaging houses are readying the next wave of IC packages, but these products must prove to be reliable before they are incorporated into systems. These packages involve several advanced technologies, such as 2.5D/3D, chiplets and fan-out, but vendors also are working on new versions of more mature package types, like wirebond and leadframe technologies. As with previous products, packaging... » read more

Many Chiplet Challenges Ahead
By Brian Bailey - 12 Apr, 2021 - Comments: 0

Over the past couple of months, Semiconductor Engineering has looked into several aspects of 2.5D and 3D system design, the emerging standards and steps that the industry is taking to make this more broadly adopted. This final article focuses on the potential problems and what remains to be addressed before the technology becomes sustainable to the mass market. Advanced packaging is seen as ... » read more

Bending The Rules With Curvilinear Technology
By Jan Willis - 05 Apr, 2021 - Comments: 0

What have been the historical hurdles for curvilinear ILT? Danping Peng, director at TSMC, reflected on his early involvement in the development of ILT and the three major hurdles encountered while at Luminescent during a panel discussion with industry experts at the eBeam Initiative’s annual event during the 2021 SPIE Advanced Lithography Conference. Among the topics covered, the panel di... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 02 Apr, 2021 - Comments: 0

Government policy President Biden has rolled out a proposal to boost the infrastructure in the U.S. As part of the plan, the president is calling on Congress to invest $50 billion in U.S. semiconductor manufacturing and research. The proposal must pass Congress, which isn’t going to be easy. “The President’s plan would invest ambitiously in U.S. semiconductor workers, manufacturing, and ... » read more

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