tag: TSMC

Industry Pushes For Fab Tool Security Standards
By Mark LaPedus - 17 Sep, 2020 - Comments: 1

The semiconductor industry is developing new cybersecurity standards for fab equipment in an effort to protect systems from potential cyberattacks, viruses, and IP theft. Two new standards are in the works, which are being formulated under the auspices of the SEMI trade group with leadership from chipmakers and others. Led by Intel and Cimetrix, the first standard deals with malware-free equ... » read more

Momentum Builds For Advanced Packaging
By Mark LaPedus - 17 Sep, 2020 - Comments: 0

The semiconductor industry is stepping up its efforts in advanced packaging, an approach that is becoming more widespread with new and complex chip designs. Foundries, OSATs and others are rolling out the next wave of advanced packaging technologies, such as 2.5D/3D, chiplets and fan-out, and they are developing more exotic packaging technologies that promise to improve performance, reduce p... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 11 Sep, 2020 - Comments: 0

Synopsys announced an electronic and photonic co-design platform for photonic integrated circuit (PIC) design, layout implementation, and verification. The OptoCompiler provides schematic-driven layout and advanced photonic layout synthesis in the same platform. AI Rambus says it clocked 4.0 Gbps on its HBM2E memory interface (PHY and controller), which is a desirable speed for AI/ML traini... » read more

OIP Ecosystem Forum 2020
By Paul McLellan - 10 Sep, 2020 - Comments: 0

Last Tuesday was the virtual TSMC OIP Ecosystem Forum. Apart from being virtual, the format was similar to the usual. Cliff Hou, Senior Vice President of Technology Development, opened the day with a summary of where everything is in the ecosystem around each of the new processes. There were then three keynotes by the leaders of the three big EDA companies. That was followed by more technical ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 04 Sep, 2020 - Comments: 0

Tools & IP Arm unveiled the Cortex-R82, a 64-bit, Linux-capable Cortex-R processor targeted for next-generation enterprise and computational storage solutions. The Cortex-R82 provides 2x performance depending on workload compared to previous Cortex-R generations and provides access of up to 1TB of DRAM for advanced data processing in storage applications. It offers an optional memory manag... » read more

Interconnects Emerge As Key Concern For Performance
By Ed Sperling - 03 Sep, 2020 - Comments: 0

Interconnects are becoming increasingly challenging to design, implement and test as the amount of data skyrockets and the ability to move that data through denser arrays of compute elements and memories becomes more difficult. The idea of an interconnect is rather simple, but ask two people what constitutes an interconnect and you're likely to get very different answers. Interconnects are e... » read more

New Architectures, Much Faster Chips
By Ed Sperling and Ann Mutschler - 31 Aug, 2020 - Comments: 0

The chip industry is making progress in multiple physical dimensions and with multiple architectural approaches, setting the stage for huge performance increases based on more modular and heterogeneous designs, new advanced packaging options, and continued scaling of digital logic for at least a couple more process nodes. A number of these changes have been discussed in recent conferences. I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Aug, 2020 - Comments: 0

Trade As reported, the U.S. recently implemented more restrictions on U.S. chip sales to Huawei. In response, SEMI has released the following statement in response to the new export control rule changes announced by the U.S. Commerce Department: “SEMI recognizes the role of export control measures to address threats to U.S. national security. However, we are very concerned the new export ... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 28 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Marvell is working on silicon for the data infrastructure market using TSMC’s 5nm process node. Marvell says it has multiple designs already under contract for its 5nm portfolio across the carrier, enterprise, automotive, and data center markets. The first products are sampling by the end of next year.  Ansys’ multiphysics signoff tools, R... » read more

Moore’s Law Enters The 4th Dimension
By Ed Sperling - 21 Aug, 2020 - Comments: 5

The basic idea that more transistors are better hasn't changed in more than half a century. In fact, the overriding theme of a number of semiconductor conferences this month is that we will never have enough compute capability or storage capacity. In the past, when the number of transistors in a given area actually did double every 18 to 24 months, increasing density per square millimeter fo... » read more

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