tag: TSMC

Week In Review: Design, Low Power
By Jesse Allen - 19 Jun, 2020 - Comments: 0

Tools & IP Rambus debuted 112G XSR/USR PHY IP on TSMC's N7 7nm process. The PHY IP enables die-to-die and die-to-optical engine connectivity for chiplets and co-packaged optics targeting data center, networking, 5G, HPC, and AI/ML applications. It has been demonstrated in silicon to exceed the reach/BER performance of the CEI-112G XSR specification and supports NRZ and PAM-4 signaling at v... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 19 Jun, 2020 - Comments: 0

Security Many IoT devices have some of the 19 bugs known as Ripple20 vulnerabilities. Researchers JSOF discovered the security flaws in library produces by Treck, Inc., which is used in many IoT devices. Edge, cloud, data center Rambus delivered its 112G XSR/USR PHY IP on TSMC 7nm process (N7). The SerDes PHY was designed for chiplets and co-packaged optics (CPO) architectures that are des... » read more

The Next Advanced Packages
By Mark LaPedus - 18 Jun, 2020 - Comments: 4

Packaging houses are readying their next-generation advanced IC packages, paving the way toward new and innovative system-level chip designs. These packages include new versions of 2.5D/3D technologies, chiplets, fan-out and even wafer-scale packaging. A given package type may include several variations. For example, vendors are developing new fan-out packages using wafers and panels. One is... » read more

Pandemics And Panic Chip Buying
By Mark LaPedus - 18 Jun, 2020 - Comments: 0

U.S.-China trade tensions are creating uncertainty in the semiconductor market, but it is also causing another event right now—panic chip buying. At present, some but not all foundry vendors are seeing “rush orders” for select products and are running their fabs at full capacity. It’s not just leading-edge devices, but also mature technologies. A surge of chip orders started in Ma... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jun, 2020 - Comments: 0

Chipmakers Jim Keller, senior vice president in the Technology, Systems Architecture and Client Group (TSCG) and general manager of the Silicon Engineering Group (SEG) at Intel, has resigned amid a major reorganization at the company. Here's one report about the situation. Cree as well as China’s Yutong Group and StarPower are working together to accelerate the commercial adoption of sili... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 12 Jun, 2020 - Comments: 0

Edge, cloud, data center Programmable logic company Efinix used Cadence’s Digital Full Flow to finish Efinix’s Trion FPGA family for edge computing, AI/ML and vision processing applications, according to a press release. Last week Efinix also announced three software defined SoCs based on the RISC-V core. The SoCs are optimized to the Trion FPGAs. AI, machine learning Amazon will tempo... » read more

Aging Problems At 5nm And Below
By Brian Bailey - 11 Jun, 2020 - Comments: 3

The mechanisms that cause aging in semiconductors have been known for a long time, but the concept did not concern most people because the expected lifetime of parts was far longer than their intended deployment in the field. In a short period of time, all of that has changed. As device geometries have become smaller, the issue has become more significant. At 5nm, it becomes an essential par... » read more

Week In Review: Design, Low Power
By Jesse Allen - 05 Jun, 2020 - Comments: 1

Tools & IP Synopsys introduced its DesignWare USB4 IP solution consisting of controllers, routers, PHYs, and verification IP. It supports USB4, DisplayPort with HDCP 2.3 security, PCI Express, and Thunderbolt 3 connectivity protocols through USB Type-C connectors and cables. The USB4 IP operates at up to 40 Gbps, twice the maximum data rate of USB 3.2, and is backwards compatible with USB 3... » read more

Ensuring HBM Reliability
By Ed Sperling - 27 May, 2020 - Comments: 0

Igor Elkanovich, CTO of GUC, and Evelyn Landman, CTO of proteanTecs, talk with Semiconductor Engineering about difficulties that crop up in advanced packaging, what’s redundant and what is not when using high-bandwidth memory, and how continuous in-circuit monitoring can identify potential problems before they happen. » read more

The Good And Bad Of Chiplets
By Mark LaPedus - 27 May, 2020 - Comments: 1

The chiplet model continues to gain traction in the market, but there are still some challenges to enable broader support for the technology. AMD, Intel, TSMC, Marvell and a few others have developed or demonstrated devices using chiplets, which is an alternative way to develop an advanced design. Beyond that, however, the adoption of chiplets is limited in the industry due to ecosystem issu... » read more

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